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Effect of Abrasive Particle Size on Lapping of Sapphire Wafer by Fixed Abrasive Pad
The choice of abrasive particle size is crucial to improve the lapping efficiency and surface quality in lapping of sapphire wafer by fixed abrasive (FA) pad. A model for the penetration depth of a single abrasive is developed with fixed abrasive pad.
Pei Cheng Shi, Yong Wei Zhu
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Lapping performance of mixed-size agglomerated diamond abrasives in fixed abrasives pads
Diamond and Related Materials, 2021Abstract Ultra-fine diamond grains are used to prepare agglomerated diamond (AD) abrasives that are, in turn, applied to make fixed agglomerated diamond abrasive (FADA) pads. The as-prepared pads demonstrated very low removal efficiency along with a poor processing stability,which limits the applicability of ultra-fine diamond grains in fixed ...
Piao Zhou, Yongwei Zhu
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A study on polishing of molds using hydrophilic fixed abrasive pad
International Journal of Machine Tools and Manufacture, 2004Abstract The finishing process for die and mold manufacturing is very important because it influences the final quality of the products. injection molds especially need higher quality surface than general purpose dies and molds. Conventional polishing cannot reduce mold surface down to nanometer roughness efficiently because of loading and glazing ...
Jae Young Choi, Hae do Jeong
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Effect of chemical additive on fixed abrasive pad self-conditioning in CMP
International Journal of Advanced Manufacturing Technology, 2016Self-conditioning performance of polishing pad is an important characteristic to influence processing efficiency and service life in chemical mechanical polishing (CMP). The slurry can react with the pad surface, which affects its self-conditioning performance in fixed abrasive polishing process.
Dunwen Zuo, Yongwei Zhu
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A Novel Technique for Dressing Fixed Abrasive Lapping Pad with Abrasive Water Jet
International Journal of Precision Engineering and Manufacturing - Green Technology, 2023Mingchao Liang +2 more
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Pattern Optimization for Phyllotactic Fixed Abrasive Pads Based on the Trajectory Method
IEEE Transactions on Semiconductor Manufacturing, 2017Fixed abrasive pads patterned with phyllotaxis theory of biology have been developed to be novel lapping and polishing pads. However, the influences of phyllotactic parameters on pad patterns were not deeply indicated. To design optimal pad patterns with fixed abrasives, the trajectory analysis method is adopted.
Zhongwei Hu, Zhao zaixing, Congfu Fang
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Research on the factors of diamond fixed-abrasive lapping pad self-condition
Ferroelectrics, 2019AbstractThe performance of the hydrophilic diamond fixed-abrasive lapping pad has great effects on successive lapping quality.
Xu Jun
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Evaluation of double sided lapping using a fixed abrasive pad for sapphire substrates
In this study, the double sided lapping behavior of sapphire substrate using fixed diamond abrasive pad was evaluated. For the lapping process, fixed diamond abrasive pad is used along with the alumina slurry.
Jin-Goo Park, Deog-Ju Moon
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Wear of Polishing Pad and Pattern Optimization of Fixed Abrasive Pad
Advanced Materials Research, 2010The polishing pad plays a significant role in the Chemical Mechanical Polishing (CMP) process and its wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is introduced and the law of pad wear along the pad radius is discussed, thus a new FAP with optimized pattern is designed and prepared in order. The flatness of
Mao Li +4 more
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