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Preparation and Evaluation of Hydrophilic Fixed Abrasive Pad
Key Engineering Materials, 2010The swelling ratio and the pencil hardness of pad were introduced to evaluate the properties of hydrophilic fixed abrasive (FA) pad. The effect of pad composition on its swelling ratio and pencil hardness was studied. Results show that the swelling ratio increases with the rise of content of Trimethylopropane Triacrylate (TMPTA) and Urethane Acrylate ...
Yong Wei Zhu, Jun Li, Jun Wang, Kui Lin
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Self-Conditioning Fixed Abrasive Pad in CMP
Journal of The Electrochemical Society, 2004It has been known that overpolishing in chemical mechanical polishing (CMP) depends on pattern selectivity as a function of density and pitch, and use of a fixed abrasive pad is one method which can improve the pattern selectivity. This paper introduces the fixed abrasive pad using the swelling characteristic of hydrophilic polymers, which can acquire ...
Hoyoun Kim +4 more
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Amorphous Diamond Dresser for CMP Fixed Abrasives Pad
Key Engineering Materials, 2007The primary consumables in chemical mechanical polishing (CMP) are the polishing pad and slurry. The polishing pad significantly influences the stability of the polishing process and the cost of consumables (CoC). Usually a diamond pad conditioner is used to scrap off the polishing debris from the pad top. Recently, an alternative planarization process
Pei Lum Tso, Yang Liang Pai
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Spiral-structured fixed-abrasive pads for glass finishing
CIRP Annals, 2013Abstract Loose-abrasive machining with cerium oxide (ceria) slurry is traditionally employed for finishing glass. However, the use of slurries can have a detrimental impact on the environment. Fixed-abrasive machining has received attention as an alternative technology; however, conventional fixed-abrasive tools are inefficient. In this study, spiral-
Toshiyuki Enomoto +3 more
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Lapping and Polishing of Sapphire Wafer with Fixed Abrasive Pad
Advanced Materials Research, 2014The processing technology of sapphire with a high material removal rate a good surface quality is critical for its applications. The experiment of sapphire lapping and polishing was carried out by using three different fixed abrasive pad (FAP). Their material removal rate (MRR) and surface roughness (Ra) were measured and analyzed.
Jian Bin Wang +4 more
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Self-conditioning performance of hydrophilic fixed abrasive pad
The International Journal of Advanced Manufacturing Technology, 2016Self-conditioning performance is one of the key properties of hydrophilic fixed abrasive (FA) pad, which affects greatly on lapping efficiency and surface quality of lapped work-piece. In order to explore the quantitative relationship between the self-conditioning performance of hydrophilic FA pad and process parameters, the material removal rate ...
Fangzhi Zheng +5 more
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An approach for hydrophobic fixed abrasive pad based on layer-by-layer method
Microelectronic Engineering, 2021Abstract Fixed abrasive polishing pad plays an important role in planarization of the surface of integrated circuit and semiconductor substrate. This paper reports a systematic approach for fabricating the pad using polyurethane, metal mold and layer-by-layer curing without binders.
Zhixiang Liu, Yunqing Tang
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Analysis and improvement of the pad wear profile in fixed abrasive polishing
The International Journal of Advanced Manufacturing Technology, 2015Fixed abrasive polishing has some advantages in generating good planarization surfaces with low defects. The surfaces after polishing have better uniformity, and the material removal rate is much higher than that of the traditional chemical mechanical polishing using loose abrasives.
N. Y. Nguyen, Z. W. Zhong, Y. B. Tian
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IEEE Transactions on Semiconductor Manufacturing, 2004
Minimization of particulates levels during the chemical-mechanical planarization (CMP) process as well as in the waste streams is possible through the use of a fixed abrasive pad (FAP). The abrasion of electrodeposited copper films using an alumina-based FAP was studied in hydrogen peroxide and hydroxylamine-based chemistries.
W.H. Huang +3 more
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Minimization of particulates levels during the chemical-mechanical planarization (CMP) process as well as in the waste streams is possible through the use of a fixed abrasive pad (FAP). The abrasion of electrodeposited copper films using an alumina-based FAP was studied in hydrogen peroxide and hydroxylamine-based chemistries.
W.H. Huang +3 more
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Process Optimization of Lapping Sapphire Substrate with Fixed Diamond Abrasive Pad
Key Engineering Materials, 2016The production cost of the sapphire substrate was restricted by the efficiency of processing and the surface quality. A proposed level orthogonal experiment was conducted to reveal the effect of workbench speed, lapping pressure, the Concentration of triethanolamine and abrasive pad types on the material removal rate and surface roughness and ...
Jian Bin Wang +4 more
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