Results 101 to 110 of about 199,581 (223)
Trapping and leakage mechanisms in GaN devices
reservedIn questo lavoro intendiamo discutere i risultati riguardo l'instabilità della tensione di soglia e i fenomeni di leakage su HEMT con struttura di gate p-GaN/AlGaN/GaN.
BENATO, ANDREA
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Growth and fabrication of AlGaN/GaN HEMT based on Si(111) substrates by MOCVD
AlGaN/GaN high electron mobility transistor (HEMT) hetero-structures were grown on the 2-in Si (1 1 1) substrate using metal-organic chemical vapor deposition (MOCVD). Low-temperature (LT) AlN layers were inserted to relieve the tension stress during the
Luo, WJ, Chinese Acad Sci, Inst Semicond, Key Lab Semicond Mat Sci, Beijing 100083, Peoples R China. 电子邮箱地址: yuntianbb@hotmail.com +11 more
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A High Performance AlGaN/GaN HEMT with a New Method for T-Gate Layout Design
We propose and fabricate an A1GaN/GaN high electron mobility transistor (HEMT) on sapphire substrate using a new kind of electron beam (EB) lithography layout for the T-gate.
Chen Zhigang +6 more
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Enhancement-mode AlGaN/GaN HEMT and MIS-HEMT technology
AlGaN/GaN heterostructure devices are capable of delivering high-frequency power amplifiers and power switches with performances far superior than those offered by the mainstream silicon technology and other advanced semiconductor technologies. Primarily
Zhou, Chunhua +3 more
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AlN/GaN HEMT Technology with In-situ SiNx Passivation
We report on the fabrication of low resistance Ohmic contacts on AlN/GaN HEMT material terminated with in-situ SiNx. The AlN/GaN material was grown on SiC substrate using metal organic chemical vapor deposition (MOCVD), and employs a 5nm in-situ SiNx ...
Ata Khalid +5 more
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Non-gold ohmic contact for GaN-on-Si HEMT
High power high frequency HEMT transistors are transistors that run at high frequency (100 kHz and above) for high-speed switching and high-power delivering applications. Kinds of III-V semiconductor materials have been studied to be applied to HEMT like
Zhuang, Yihao
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Simplified EPFL GaN HEMT Model
This paper introduces a simplified and design-oriented version of the EPFL HEMT model [1], focusing on the normalized transconductance-to-current characteristic (Gm/ID ). Relying on these figures, insights into GaN HEMT modeling in relation to technology
Jazaeri, Farzan +6 more
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Computational-fitting method for mobility extraction in GaN HEMT. [PDF]
Chang KC +5 more
europepmc +1 more source
研制成功具有场板结构的AlGaN/GaN HEMT器件,对源场板、栅场板器件的性能进行了分析.场板的引入减小了器件漏电和肖特基漏电,提高了肖特基反向击穿电压.源漏间距4μm的HEMT的击穿电压由常规器件的65V提高到100V以上,肖特基反向漏电由37μA减小到5.7μA,减小了一个量级.肖特基击穿电压由常规结构的78V提高到100V以上.另外 ...
魏珂, 和致经, 吴德馨, 刘新宇
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A Wideband True Time Delay Circuit Using 0.25 µm GaN HEMT Technology. [PDF]
Kim JG, Baek D.
europepmc +1 more source

