Results 1 to 10 of about 25,253 (200)

Damage Mechanism Analysis of High Field Stress on Cascode GaN HEMT Power Devices [PDF]

open access: yesMicromachines
A series of problems, such as material damage and charge trap, can be caused when GaN HEMT power devices are subjected to high field stress in the off-state.
Shuo Su   +12 more
doaj   +2 more sources

Scedosporium infection as a late complication after start of elexacaftor/tezacaftor/ivacaftor: two case reports [PDF]

open access: yesRespiratory Medicine Case Reports
Highly effective modulator treatment (HEMT) has resulted in an improved prognosis for people with cystic fibrosis (pwCF). In this case report, we present two pwCF with clinical stabilization after start of HEMT who developed complicated fungal infections
P van Mourik, MD PhD   +6 more
doaj   +2 more sources

Transistors for Solid-State Microwave Switches (A Review)

open access: yesИзвестия высших учебных заведений России: Радиоэлектроника, 2023
Introduction. The characteristics of solid-state microwave switches are subject to different requirements depending on the application area and technical problems to be solved. No versatile solution exists that could satisfy all requirements at once. The
Elena M. Torina   +2 more
doaj   +1 more source

Study of AlGaN/GaN Vertical Superjunction HEMT for Improvement of Breakdown Voltage and Specific On-Resistance

open access: yesIEEE Access, 2021
A GaN-based vertical superjunction high electron mobility transistor (SJ HEMT) with a composite structure (CS-SJ HEMT) is proposed and analyzed by Silvaco TCAD to improve the breakdown voltage and specific on-resistance (RonA).
Miao Zhang   +8 more
doaj   +1 more source

Temperature-dependent characteristics for the p-type CuO gate HEMT and high-k HfO2 MIS-HEMT on the Si substrates

open access: yesAIP Advances, 2021
This work presents the temperature-dependent characteristics of the thin-barrier Al0.45Ga0.55N/GaN high electron mobility transistor (HEMT), p-type CuO gate HEMT, and high-k HfO2 metal–insulator–semiconductor HEMT (MIS-HEMT).
Yaopeng Zhao   +7 more
doaj   +1 more source

Multi-objective optimization of the high electron mobility transistor

open access: yesInternational Journal for Simulation and Multidisciplinary Design Optimization, 2023
In this paper, we present a new approach to improve the thermo-mechanical performance of the HEMT (high electron mobility transistor) technology. This study aims to solve two optimization problems.
Amar Abdelhamid   +3 more
doaj   +1 more source

FUTURE TRENDS IN POWER ELECTRONIC DEVICES [PDF]

open access: yesJournal of Engineering Science (Chişinău), 2019
The recent technological progress of semiconductors and increasing demand for power electronic devices in the different domains of electric energy particularly for applications in aeronautics and networks of transport and distribution impose new ...
Băjenescu, Titu-Marius I.
doaj   +1 more source

The proton flux influence on electrical characteristics of a dual-channel hemt based on GaAs

open access: yesДоклады Белорусского государственного университета информатики и радиоэлектроники, 2022
The results of the simulation the influence of the proton flux on the electrical characteristics of the device structure of dual-channel high electron mobility field effect transistor based on GaAs are presented.
I. Yu. Lovshenko   +7 more
doaj   +1 more source

On large-signal modeling of GaN HEMTs: past, development and future

open access: yesChip, 2023
In the past few decades, circuits based on gallium nitride high electron mobility transistor (GaN HEMT) have demonstrated exceptional potential in a wide range of high-power and high-frequency applications, such as the new generation mobile ...
Haorui Luo, Wenrui Hu, Yongxin Guo
doaj   +1 more source

Analysis of issues in gate recess etching in the InAlAs/InGaAs HEMT manufacturing process

open access: yesETRI Journal, 2023
We have developed an InAlAs/InGaAs metamorphic high electron mobility transistor device fabrication process where the gate length can be tuned within the range of 0.13 μm–0.16 μm to suit the intended application.
Byoung-Gue Min   +7 more
doaj   +1 more source

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