Results 11 to 20 of about 57,323 (293)
Peculiarities of the interface between high-permittivity dielectrics and semiconductors
Replacement of the silicon dioxide thin films in metal-oxide-semiconductor structures for microelectronics with high permittivity dielectrics (high-k) is a crucial step in the further down-scaling of microelectronic devices.
Nenad eNovkovski
doaj +1 more source
This paper investigates the double dielectrics enhancement LDMOS (DDE LDMOS) with high-k field dielectric and low-k buried dielectric. The analytical models of the potential and electric field, optimal breakdown voltage and drift doping concentration are
Jiafei Yao +8 more
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Accurate modeling of gate capacitance in deep submicron MOSFETs with high-K gate-dielectrics [PDF]
Gate capacitance of metal-oxide-semiconductor devices with ultra-thin high-K gate-dielectric materials is calculated taking into account the penetration of wave functions into the gate-dielectric.
A. Haque +16 more
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High K Low Loss Dielectrics Co-Fireable with LTCC
Rapid growth in the application of LTCC technology for RF wireless is clearly driven by the trend of miniaturization and mobile communication systems. This technology provides the possibility of integration of passive components in a cost effective way ...
Christina Modes +2 more
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Hysteresis-Free Nanosecond Pulsed Electrical Characterization of Top-Gated Graphene Transistors [PDF]
We measure top-gated graphene field effect transistors (GFETs) with nanosecond-range pulsed gate and drain voltages. Due to high-k dielectric or graphene imperfections, the drain current decreases ~10% over time scales of ~10 us, consistent with charge ...
Behnam, Ashkan +8 more
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Microelectronics has been the most important driving force for almost all kinds of technology evolutions in the past four decades. The size of the metal-oxide-semiconductor (MOS) transistor, which underpins Si microelectronics, has been reduced to a factor of 1,000.
Durga Misra, Hiroshi Iwai, Hei Wong
openaire +1 more source
Recently, demands for high‐performance polymer film capacitors at elevated temperatures have become more urgent. High dielectric constant is essential for dielectric materials to achieve substantial energy density at relatively low electric fields, which
Sang Cheng +5 more
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In this paper, the GaN-based MIS-HEMTs with Si3N4 single-layer passivation, Al2O3/SiNx bilayer passivation, and ZrO2/SiNx bilayer passivation are demonstrated.
Yutao Cai +7 more
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Challenges for 10 nm MOSFET process integration
An overview of critical integration issues for future generation MOSFETs towards 10 nm gate length is presented. Novel materials and innovative structures are discussed.
Mikael Östling +6 more
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Degradation and breakdown characteristics of thin MgO dielectric layers [PDF]
MgO has been suggested as a possible high-k dielectric for future complementary metal-oxide semiconductor processes. In this work, the time dependent dielectric breakdown (TDDB) characteristics of 20 nm MgO films are discussed.
Degraeve R. +5 more
core +1 more source

