Results 61 to 70 of about 22,416,589 (293)

Adaptive Foam 3D Printing of Ultralight and Multifunctional Materials

Advanced Engineering Materials, EarlyView.
Adaptive foam 3D printing, enabled by expandable microspheres, imparts cellular structures to thermoplastic and thermosetting polymers, manufactured through a variety of processes including fused filament fabrication, direct ink writing, digital light processing, and inkjet printing.
Nariman Rajabifar, Amir Ameli
wiley   +1 more source

Fabrication Routes for Ionic Conducting Fiber Strain Sensors

Advanced Engineering Materials, EarlyView.
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw, Zhanhong Yang, Anne Ladegaard Skov, Magdalena Skowyra   +3 more
wiley   +1 more source

High-k dielectrics on (100) and (110) n-InAs: Physical and electrical characterizations

AIP Advances, 2014
Two high-k dielectric materials (Al2O3 and HfO2) were deposited on n-type (100) and (110) InAs surface orientations to investigate physical properties of the oxide/semiconductor interfaces and the interface trap density (Dit).
C. H. Wang, G. Doornbos, G. Astromskas, G. Vellianitis, R. Oxland, M. C. Holland, M. L. Huang, C. H. Lin, C. H. Hsieh, Y. S. Chang, T. L. Lee, Y. Y. Chen, P. Ramvall, E. Lind, W. C. Hsu, L.-E. Wernersson, R. Droopad, M. Passlack, C. H. Diaz   +18 more
doaj   +1 more source

Materials‐Driven Additive Manufacturing for Electrical Machines: Qualification‐Oriented Design Beyond Geometric Freedom

Advanced Engineering Materials, EarlyView.
This perspective reframes additive manufacturing for electrical machines as a qualification‐limited materials and architecture design problem. It links process–structure–property–performance relationships to magnetic, conducting, dielectric, and thermal property windows, highlighting where AM can enable segmented magnetic circuits, permanent magnet ...
Dénes Fodor, Loránd Szabó
wiley   +1 more source

Effects of Mg on Microstructure and Solidification of a Hypereutectic Zn–8 wt.%Al Alloy

Advanced Engineering Materials, EarlyView.
An appreciable set of results involving thermal data, microstructure, chemical composition, and microstructural growth laws is reported for ZnAlMg alloys. Such results demonstrate that ZnAlMg alloys have high potential for applications in automotive self‐lubricating components, batteries, and electrical systems.
Raí B. de Sousa, Jeverton L. Paixão, Daylla S. Silva, Bruno S. Sobral, Mucio D. de Medeiros, José E. Spinelli, Bismarck L. Silva   +6 more
wiley   +1 more source

Alternative high-k dielectrics for semiconductor applications

, 2009
Although the next generation high-k gate dielectrics has been defined for the 45 nm complementary metal oxide semiconductor technology node, threshold voltage control and equivalent oxide thickness (EOT) scaling remain concerns for future devices ...
Adelmann, C., Clima, S., J. A. Kittl, De Gendt, S., C. Adelmann, Maes, J. W., J. Swerts, Wouters, D. J., M. K. Van Bael, Pierreux, D., Kittl, J. A., Popovici, M., T. Schram, D. Dewulf, Schram, T., X. P. Wang, T. Blomberg, G. Pourtois, Wang, X. P., P. Lehnen, Blomberg, T., M. Popovici, VAN BAEL, Marlies, O. Richard, N. Menou, DEWULF, Daan, Swerts, J., T. Conard, HARDY, An, A. Delabie, D. J. Wouters, Richard, O., J. Meersschaut, Lehnen, P., A. Franquet, S. Clima, A. Hardy, S. Van Elshocht, D. Pierreux, Delabie, A., Pourtois, G., S. De Gendt, Menou, N., Franquet, A., Van Elshocht, S., Meersschaut, J., J. W. Maes, Conard, T.   +47 more
core   +1 more source

FastNano Liquid: An Automated Platform for Small‐Angle X‐ray Scattering‐Based Materials Discovery

Advanced Engineering Materials, EarlyView.
We present FastNano Liquid, an automated small‐ and wide‐angle X‐ray scattering platform for the combined synthesis and characterization of (nano)materials. The platform is coupled to varied reactor workflows for both in situ studies of reaction kinetics and ex situ screening of synthesis conditions to support machine learning‐guided exploration ...
Pierre‐Baptiste Flandrin, Émeline Cournède, Jens Krarup, Michael Lesa, Foyzul Hasan, Amandine Séné, Arnaud Lahouati, David Benhaiem, Jérémie‐Luc Sanchez, Simon Delacroix, Thierry Gacoin, Fabienne Testard, Damien Faivre, David Carriere, Corinne Chevallard, Olivier Taché, Mark A. Levenstein   +16 more
wiley   +1 more source

Scaling of Hafnium-based High-k Dielectrics

, 2007
In this paper, various approaches to extend scalability of Hafnium-based dielectrics are reported. Among the three crystal phases of HfO2 (monoclinic, cubic and tetragonal), the tetragonal phase has been reported to have the highest dielectric constant.
Rama I. Hegde, James K. Schaeffer, Rich Gregory, David C. Gilmer, Dina H. Triyoso, Nevine Rochat, Vidya Kaushik, Srikanth B. Samavedam   +7 more
core   +1 more source

A new analytical method for characterising the bonding environment at rough interfaces in high-k gate stacks using electron energy loss spectroscopy [PDF]

, 2010
Determining the bonding environment at a rough interface, using for example the near-edge fine structure in electron energy loss spectroscopy (EELS), is problematic since the measurement contains information from the interface and surrounding matrix ...
MacKenzie, M., MacKenzie M, Craven AJ, Craven, AJ, Mendis BG, MacKenzie, M, Mendis, BG, Mendis, B.G., Craven, A.J.   +8 more
core   +1 more source

Humidity-robust semi-aromatic polyimides with cyclohexyl-substituted double-decker-shaped silsesquioxane exhibiting low dielectric losses at 10-20 GHz

Communications Materials
Emerging high-frequency electronics require polymer dielectrics that combine a low dielectric constant (D k) with an ultra-low dissipation factor (D f) under realistic humidity.
Natsuko Sashi, Erina Yoshida, Hayato Maeda, Riku Takahashi, Kan Hatakeyama-Sato, Yuta Nabae, Masatoshi Tokita, Ririka Sawada, Shinji Ando, Teruaki Hayakawa   +9 more
doaj   +1 more source