Results 71 to 80 of about 1,991 (213)
Improved LDMOS performance with buried multi-finger gates [PDF]
SOI LDMOS with buried multi-finger gates (BFG) is proposed and fabricated. The BFG acts as field plate, modulating the lateral electric field distribution in the drift region (off-state) and enhances the carrier accumulation at the surface of the drift ...
Liu, Linjie +9 more
core +1 more source
Mode of operation f VDS PL(AV) Gp ηD ACPR [PDF]
40 W LDMOS power transistor for base station applications at frequencies ...
Power Ldmos Transistor, Product Profile
core
SPICE model of LDMOS structure [PDF]
V této bakalářské práci je provedeno porovnání struktury LDMOS oproti konvenční MOS struktuře. Anomální efekty, výzvy, které tato struktura přináší do oblasti modelování a charakterizace jsou popsány v první kapitole. Další část této práce se zaměřuje na
Loginov, Dmitrii
core +2 more sources
Characterization and Modeling of SH in Multi-Finger RF LDMOS Transistors Using BSIM-BULK Model
In this work, we present self-heating (SH) characterization and modeling of 130 nm Bipolar-CMOS-DMOS (BCD) technology node multi-finger Laterally Diffused Metal-Oxide-Semiconductor (LDMOS) transistors using extensive DC and S-parameter ...
Ayushi Sharma +5 more
doaj +1 more source
1.2 Features and benefits Excellent ruggedness [PDF]
100 W LDMOS power transistor for base station applications at frequencies ...
Power Ldmos Transistor, High Efficiency
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Numerical investigation on L-shaped vertical field plate in high-voltage LDMOS
In this work, an L-shaped vertical field plate (LVFP) is introduced in high-voltage lateral double-diffused MOSFET (LDMOS). The LVFP is embedded in an oxide trench that penetrates into the drift region. Compared with the conventional vertical field plate
Yue Hu +5 more
doaj +1 more source
Reduction of Self-heating effect in LDMOS devices
17 pages, 5 ...
Tapas Kumar Maiti, Chinmay K. Maiti
openaire +2 more sources
Hot-carrier Stress induced degradation in Multi-STIFinger LDMOS: an experimental and numerical insight [PDF]
Degradation induced by hot-carrier stress (HCS) in a Multi-STI-Finger (MF) LDMOS is analyzed through both electrical measurements and TCAD simulations. The critical HCS issues have been first addressed on a conventional STIbased LDMOS.
R. Wise +14 more
core +1 more source
To elaborate on the relationship between sophisticated 2-D doping profile of drift region and device's breakdown behavior, a unified analytical model for the SOI LDMOS is developed in this paper.
Kemeng Yang +6 more
doaj +1 more source
Development of ESD Robustness Enhancement of a Novel 800V LDMOS Multiple RESURF with Linear P-top Rings [PDF]
[[abstract]]"In this work, a novel 800V multiple RESURF LDMOS structures with or without P+ insertion region next to drain were developed to study the enhancement of ESD robustness.
蔡宗叡;Tsai, Jung-Ruey;許健;Sheu, Gene;楊紹明;Yang, Shao-Ming
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