Results 31 to 40 of about 213,422 (311)
Advanced Engineering Materials, EarlyView.This article demonstrates the successful qualification of a copper–tungsten composite for laser powder bed fusion. The resulting components exhibited high density, high thermal conductivity, and reduced thermal expansion. Heat sinks with complex geometries were successfully manufactured, clearly showcasing the material's potential for additive ...
Simon Rauh +6 more
wiley +1 more source
High-k HfO2 Based Metal-Oxide-Semiconductor Devices Using Silicon and Silicon Carbide Semiconductor [PDF]
Журнал нано- та електронної фізики, 2011 In this paper we have calculated the flatband capacitance (CFB) for high-k dielectric material hafnia oxide (HfO2) as an insulator and silicon carbide (SiC) as a semiconductor material for metal-oxide-semiconductor (MOS) devices.
N.P. Maity +3 more
doaj
A General Route for Growing Metal Sulfides onto Graphene Oxide and Exfoliated Graphite Oxide
Nanomaterials, 2017 Graphene-based materials are elective materials for a number of technologies due to their unique properties. Also, semiconductor nanocrystals have been extensively explored due to their size-dependent properties that make them useful for several ...
Joana L. Lopes +4 more
doaj +1 more source
Synthesis of a nano-silver metal ink for use in thick conductive film fabrication applied on a semiconductor package. [PDF]
PLoS ONE, 2014 The success of printing technology in the electronics industry primarily depends on the availability of metal printing ink. Various types of commercially available metal ink are widely used in different industries such as the solar cell, radio frequency ...
Lai Chin Yung +4 more
doaj +1 more source
Fractal and Fractional, 2021 An alternative procedure for the implementation of fractional-order compensators is presented in this work. The employment of a curve-fitting-based approximation technique for the approximation of the compensator transfer function offers improved ...
Evisa Memlikai +6 more
doaj +1 more source
Advanced Engineering Materials, EarlyView.Carbon nanomaterial‐reinforced epoxy composites exhibit pronounced piezoresistive behavior, enabling intrinsic damage sensing under cyclic and fatigue loading. This review critically compares carbon nanotube and graphene systems, correlating filler content, percolation threshold, and gauge factor with sensing stability and damage evolution.
J. M. Parente +3 more
wiley +1 more source
3D‐Printed Giant Magnetoresistive (GMR) Sensors Based on Self Compliant Springs
Advanced Engineering Materials, EarlyView.This work explores 3D‐printed GMR sensors utilizing self‐compliant spring structures and conductive PLA composites. By optimizing arm width, we achieved high piezoresistive (0.34%/mm) and magnetoresistive (0.77%/mT) sensitivities. Demonstrated through Bluetooth‐integrated pressure and magnetic position sensing, these full printed low‐cost, customizable
Josu Fernández Maestu +4 more
wiley +1 more source
Ohmic-to-Schottky Modification of Zno-Metal Contact Modulated by Film Thickness [PDF]
Materials ResearchThis work investigated the charge transport behavior at the interface between a Pt-Ir metal contact and transparent zinc oxide (ZnO) electrodes with one, four, and eight ZnO layers.
Raquele Lima Moreira +4 more
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The advancement of silicon-on-insulator (SOI) devices and their basic properties
Semiconductor Physics, Quantum Electronics & Optoelectronics, 2020 Silicon-on-insulator (SOI) is most promising present-day silicon technology. The use of SOI provides significant benefits over traditional bulk silicon technology in fabrication of many integrated circuits (ICs), and in particular, complementary metal ...
T.E. Rudenko, A.N. Nazarov, V.S. Lysenko
doaj +1 more source
Metal oxide semiconductor thin-film transistors for flexible electronics [PDF]
, 2016 The field of flexible electronics has rapidly expanded over the last decades, pioneering novel applications, such as wearable and textile integrated devices, seamless and embedded patch-like systems, soft electronic skins, as well as imperceptible and ...
Cherenack K. +12 more
core +1 more source