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Calibration of the Wireless Unit of Micromechanical Accelerometers
Applied Mechanics and Materials, 2012The report describes an original method of calibrating an autonomous unit of wireless accelerometers manufactured by Microdevices Laboratory, Ltd [1]. Without the use of precision rotary tables, centrifuges, and an independent basement (against vibrations), it is possible to reduce the error caused by the mismatch (not orthogonal)of sensor’s axes. Zero
Alexey Timoshenkov +3 more
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Design and analysis of micromechanical resonant accelerometer
2012 8th IEEE International Symposium on Instrumentation and Control Technology (ISICT) Proceedings, 2012A novel micro resonant accelerometer was designed for increasing the sensitivity of resonant accelerometer, which includes two double-ended tuning forks, a proof mass, two-leverage system amplifying inertial force, and drive/sense combs. Each tuning fork is electro-statically actuated and sensed at resonance using comb electrodes.
Jing Li +5 more
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Research of the micromechanical three-axis accelerometer
SPIE Proceedings, 2016In the report the linear acceleration sensor design with three axis of sensitivity is researched. Parameterized geometry and finite element model for modal analysis are developed in the ANSYS program. Behavioral description of the study design is developed with language VHDL-AMS to simulate the sensor operation under the influence of linear ...
B. Konoplev +4 more
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Micromechanical accelerometer integrated with MOS detection circuitry
IEEE Transactions on Electron Devices, 1982A cantilever beam accelerometer is described in which the small cantilever sensing element is integrated with and fabricated alongside MOS detection circuitry. The total area of the detector/circuit combination is about 15000 µm2(24 mil2). Fully compatible and conventional materials and processing steps are employed throughout the fabrication schedule.
K.E. Petersen, A. Shartel, N.F. Raley
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Micromechanical accelerometer integrated with MOS detection circuitry
1980 International Electron Devices Meeting, 1980A cantilever beam accelerometer has been demonstrated in which the small cantilever sensing element is integrated with and fabricated alongside MOS detection circuitry. Fully compatible and conventional materials and processing steps are employed throughout the fabrication schedule.
K. Petersen, A. Shartel
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Silicon micromechanical accelerometer using an optical fiber
SPIE Proceedings, 2002In this paper, a new type of silicon micro-mechanical accelerometer using an optical fiber is presented. The mechanical element of the accelerometer is fabricated by an unconventional wet etching process of silicon, resulting in symmetrically suspended seismic masses with a high lateral sensitivity and very low transverse sensitivities.
Tongyu Wang, Shuren Zhang
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Application of microlever to micromechanical silicon resonant accelerometers
Optics and Precision Engineering, 2011A micromechanical Silicon Resonant Accelerometer(SRA) prototype fabricated by Deep Dry Silicon on Glass(DDSOG) process was presented.The amplification of single-stage microlever in the SRA to the interial force was researched,then it pointed out that the scale factor of SRA is proportional to the system amplification factor n.The theoretical model of ...
石然 SHI Ran +3 more
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Design of the Analog Front-End for the Micromechanical Accelerometer
2020The given work is devoted to the design of the analog front-end of the capacitive MEMS accelerometer. In the following thesis the basic capacitive accelerometer ASIC design approaches are discussed. The main error sources in such systems are analyzed.
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Linearity enhancement of scale factor in an optical interrogated micromechanical accelerometer
Applied Optics, 2016A method to reduce the residual stress of support arms in an optical interrogated micromechanical accelerometer is proposed in order to enhance the linearity of the scale factor of the accelerometer. First, the behavior of residual stress in support arms is analyzed in detail, and the simulation of shape curvature caused by residual stress in aluminum ...
Yu, Zhang +3 more
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Technology tools for a high precision accelerometer in bulk micromechanics
Microsystem Technologies, 1994The high precision accelerometer consists of 5 silicon wafers and packages by silicon fusion bonding. The sensor has a capacitance measuring principle and works in an open loop or closed loop operation mode. The etching process for the realization of thin beams and seismic mass, the silicon fusion bonding and the metallization process are described.
T. Geßner, E. Vetter, M. Wiemer
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