Results 81 to 90 of about 3,715 (198)
A compact 60‐GHz on‐chip bandpass filter in GaAs technology
A compact 60‐GHz on‐chip bandpass filter (BPF) is presented using gallium arsenide (GaAs) technology. The measurements show that it has a centre frequency of 60.2 GHz with a bandwidth of 14%, and the minimum insertion loss (IL) within the passband is 2.57 dB. The chip size, excluding the feedings, is about 0.265 mm × 0.184 mm. Abstract A compact 60‐GHz
Kai‐Da Xu +3 more
wiley +1 more source
A 24 GHz up-converter mixer design with balun circuit
Based on the structure of Gilbert,a 24 GHz up-conversion mixer was designed with three-piece balun circuit on-chip. Using the gm/I method to coordinate the transistor size to obtain better conversion gain, isolation degree and circuit dissipation power ...
Zhou Zhengxuan +3 more
doaj +1 more source
A comprehensive packaging solution from DC to 113 GHz for InGaAs amplifiers
This letter describes an ultra‐broadband amplifier package operating from DC to 113 GHz, boasting a 12.5 dB average gain. It employs InGaAs amplifier IC in metamorphic high‐electron‐mobility‐transistor technology, mounted on an aluminum submount for low thermal resistance, with 1 mm connectors for ease of use.
Luca Valenziano +6 more
wiley +1 more source
Miniature Multi-Band Absorptive Bandstop Filter Designs Using Bridged-T Coils
In this paper, miniature absorptive bandstop filters (ABSFs) with one to three stopbands are demonstrated. First, the proposed single-band ABSF is realized by the introduction of one lossy resonator to a conventional stub bandstop filter, while the ...
En-Wei Chang, Yo-Shen Lin
doaj +1 more source
Imaging Capability of PHEMT, GaN/AlGaN and Si Micro Hall Probes for Scanning Hall Probe Microscopy between 25°C-125°C [PDF]
R. Akram, M.
Oral, Ahmet
core
MMIC power amplifiers as local oscillator drivers for FIRST [PDF]
The Heterodyne Instrument for the Far-Infrared and Sub- millimeter Telescope requires local oscillators well into the terahertz frequency range. The mechanism to realize the local oscillators will involve synthesizers, active multiplier chains (AMC's ...
Bruston, J. +11 more
core +1 more source
Thermal Characteristic Investigation for a Multichip Module Based on APDL
Aiming at the failure problems of integrated circuit (IC) caused by higher package density, thinner package, and more heat sources, taking a multichip module (MCM) for receiver front end as an example, the 3‐D model is established based on ANSYS Parametric Design Language (APDL).
Qian Lin +4 more
wiley +1 more source
Hotspot Estimation for Antenna-Less Backscatter Communication Using Excited Impedance Analysis [PDF]
This paper proposes a novel method for determining the optimal mounting position of nonlinear components for antenna-less backscatter communication using ground (GND) plane patterns on printed circuit boards (PCB).
Junwoo Cha +2 more
doaj +1 more source
A new high-efficiency K-band MMIC medium-power amplifier (PA) is designed with multiharmonic matching using GaAs pHEMT process technology. It has an operation frequency centered at 26 GHz with a bandwidth of 2 GHz.
Y. Shang +9 more
doaj +1 more source
UWB-MMIC Matrix Distributed Low Noise Amplifier
In this paper, a 3.1–11 GHz ultra-wideband low noise amplifier with low noise figure, high power gain S21, low reverse gain S12, and high linearity using the OMMIC ED02AH process, which employs a 0.18 μm Pseudomorphic High Electron Mobility Transistor is
Moustapha El Bakkali +4 more
doaj +1 more source

