Results 61 to 70 of about 6,644,773 (301)

CO2‐to‐CO Conversion in a Gas‐Fed, Zero‐Gap, PEM Electrolyzer Enabled by Polycations and Nitrogen‐Doped Carbon‐Supported Cobalt Nanoparticles

open access: yesAdvanced Functional Materials, EarlyView.
A gas‐fed, zero‐gap, PEM CO2 electrolyzer is realized by incorporating PDDA+ ions onto the carbonaceous Co/N‐C electrocatalyst, with gaseous H2 and CO2 fed into the anode and cathode, respectively. Operating without an aqueous electrolyte, the system sustains a peak FECO of 65.1% at 100 mA cm−2. ABSTRACT Electrochemical carbon dioxide reduction (ECO2R)
Yuen Leong Chow   +6 more
wiley   +1 more source

EFFECT OF OXYGEN ON SI ETCH PROFILE USING DC SF6 PLASMA MICROMACHINING

open access: yesDiyala Journal of Engineering Sciences, 2010
Plasma etching with tapered profile structure (high aspect ratio structures) in silicon is an important step in manufacturing capacitors for memory devices and integrated components of microelectromechanical systems. In these applications, the goal is to
Shrok Abdullah
doaj  

Advances in Solution‐Processed Textile Triboelectric Nanogenerators: Ink Formation, Processing Strategies, Applications, and Challenges

open access: yesAdvanced Functional Materials, EarlyView.
Advanced ink systems for solution‐processed textile triboelectric nanogenerators are systematically summarized, spanning conductive, tribo‐negative, and tribo‐positive layers. By connecting ink chemistry, deposition methods, and device function, the present review reveals the key governing principles of solution development and highlights practical ...
Xinlong Sun, Stephen Beeby
wiley   +1 more source

Plasma and Gas‐based Semiconductor Technologies for 2D Materials with Computational Simulation & Electronic Applications

open access: yesAdvanced Electronic Materials
The technique of plasma processing is beneficial for wafer cleaning and precision etching of integrated circuits and essential in manufacture of advanced semiconductor devices with unmatched perfection. Research on two‐dimensional (2D) materials, such as
Changmin Kim   +5 more
doaj   +1 more source

Designing Vanadium‐Based Oxide Electrocatalysts for Water Splitting: Experimental and Mechanistic Insights with Machine Learning

open access: yesAdvanced Functional Materials, EarlyView.
This review establishes structure‐property‐mechanism relationships across six modification strategies for V‐based oxide water‐splitting electrocatalysts: lattice engineering, heteroatom doping, interface engineering, carbon‐based hybridization, morphology engineering, and surface reconstruction and pre‐catalyst design, where dissolution is reframed as ...
Youness El Issmaeli   +4 more
wiley   +1 more source

Influence of plasma-chemical etching on the surface structure of silicon wafers for photovoltaic converters

open access: yesТехнологія та конструювання в електронній апаратурі, 2006
The results of plasma-chemical etching (PCE) of the surface of photovoltaic converter (PVC) wafers, pre-structured by chemical etching, are presented. PCE was carried out in a plasma-chemical reactor using a mixture of sulfur hexafluoride (SF₆) and 10 ...
B. P. Polozov   +4 more
doaj  

Combined D-optimal design and generalized regression neural network for modeling of plasma etching rate

open access: yesInternational Journal of Metrology and Quality Engineering, 2014
Plasma etching process plays a critical role in semiconductor manufacturing. Because physical and chemical mechanisms involved in plasma etching are extremely complicated, models supporting process control are difficult to construct ...
You Hailong   +3 more
doaj   +1 more source

Rapid Microwave Plasma Engineering of HfO2/C@C Core‐Shell Fibrous Membrane Toward Flexible High‐Performance Electromagnetic Wave Absorption

open access: yesAdvanced Functional Materials, EarlyView.
Rapid microwave plasma torch engineering tunes crystal phases, carbon graphitization and oxygen‐vacancy defects in HfO2/C@C core‐shell fibrous membranes. Synergistic multi‐loss effects optimize impedance matching to deliver −65.75 dB reflection loss and a 7.37 GHz effective bandwidth for flexible electromagnetic wave absorption.
Qichao Ding   +14 more
wiley   +1 more source

Etching and annealing treatment to improve the plasma-deposited SiOx film adhesion force

open access: yes, 2021
In this paper, an atmospheric pressure plasma jet driven by an AC power supply was applied for SiOx film deposition on a metal surface. To improve the adhesion strength between the film and substrate, the processes of plasma etching and annealing were ...
Liang, L   +4 more
core   +1 more source

An Adaptive Inhibitory WSe2 Transistor for Retinomorphic In‐Sensor Image Processing

open access: yesAdvanced Functional Materials, EarlyView.
Conventional retinomorphic devices typically require deliberate gate‐bias tuning for each illumination condition. In this paper, we demonstrate an adaptive inhibitory WSe2 transistor that uses photo‐induced regime shift between the subthreshold and accumulation modes to achieve decision‐free, intensity‐adaptive image processing within a single pixel ...
Juhwan Baek   +12 more
wiley   +1 more source

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