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A model for reactive sputtering with magnetrons

Vacuum, 1989
Abstract Reactive sputtering of nitrides and oxides are used to produce compound thin films. Recently presented models, for small amounts of reactive gas (
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Reactivity and Structure of Sputtered Species

1986
A high-pressure, fast-atom bombardment (FAB) ion source has been constructed [1] to study ion/molecule reactions of sputtered ions and neutrals. Pressures in this ion source are typically on the order of 0.1 to 0.5 Torr. Studies of metal cluster ion chemistry have been performed using this chemical ionization/fast-atom bombardment (CI/FAB) source with ...
R. B. Freas, J. E. Campana
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Simulation of Reactive Sputtering. Fundamentals

LETI Transactions on Electrical Engineering & Computer Science
This work aims to describe the fundamental principles whose application for the purposes of modelling various physical and chemical processes has proven to be effective. The model of a process is defined as its representation using another similar (or identical) process, constructed based on a number of simplifying assumptions. Such a representation is
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Reactive sputtering

Microelectronics Reliability, 1984
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Reactive sputtering process

Metal Finishing, 1997
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The mechanism of d.c. reactive sputtering

Thin Solid Films, 1981
B. Goranchev, I. Petrov, V. Orlinov
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Reactive sputtering of TiC with oxygen

Thin Solid Films, 1975
William D. Sproul, March H. Richman
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Reactively Sputtered Oxide Films

Journal of The Electrochemical Society, 1969
M. L Lieberman, K. C. Medrud
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Target for reactive sputtering

Metal Finishing, 1996
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