Results 21 to 30 of about 21,181 (269)

Viable 3C-SiC-on-Si MOSFET design disrupting current Material Technology Limitations [PDF]

open access: yes, 2019
The cubic polytype (3C-) of Silicon Carbide (SiC) is an emerging semiconductor technology for power devices. The featured isotropic material properties along with the Wide Band Gap (WBG) characteristics make it an excellent choice for power Metal Oxide ...
Antoniou, M   +6 more
core   +1 more source

Self-Adaption Dead-Time Setting for the SiC MOSFET Boost Circuit in the Synchronous Working Mode

open access: yesIEEE Access, 2022
To improve the DC-bus voltage and the switching frequency of the boost circuit and reduce the volume of the passive filter element and the heatsink, the SiC MOSFET should be used as the main switching device.
Lei Zhang   +5 more
doaj   +1 more source

High-Temperature Characterizations of a Half-Bridge Wire-Bondless SiC MOSFET Module

open access: yesIEEE Journal of the Electron Devices Society, 2021
SiC MOSFET allows higher temperature capability with higher switching efficiency than that of conventional Si devices, due to its superior electrical and thermal properties.
Yue Chen   +3 more
doaj   +1 more source

Recent Advances in Short Circuit Protection Methods for SiC MOSFET [PDF]

open access: yesMATEC Web of Conferences, 2023
Due to its high efficiency, low switching losses, and high temperature stability, Silicon Carbide (SiC) Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) has been widely used in various fields.
Gao Tiecheng
doaj   +1 more source

Switching investigations on a SiC MOSFET in a TO-247 package [PDF]

open access: yesIECON 2014 - 40th Annual Conference of the IEEE Industrial Electronics Society, 2014
This paper deals with the switching behavior of a SiC MOSFET in a TO-247 package. Based on simulations, critical parasitic inductances in the circuit layout are analyzed and their effect on the switching losses highlighted. Especially the common source inductance, a critical parameter in a TO-247 package, has a major influence on the switching energy ...
Alexander Anthon   +3 more
openaire   +1 more source

An Investigation of Gate Voltage Oscillation and its Suppression for SiC MOSFET

open access: yesIEEE Access, 2020
Silicon Carbide (SiC) MOSFET has undergone a rapid development and commercialization in recent years due to its superior features. However, the mainstream commercial SiC MOFESTs are often fitted to packages that are previously designed for silicon-based ...
Weichi Zhang   +5 more
doaj   +1 more source

Performance limits of high voltage press-pack SiC IGBT and SiC MOSFET devices

open access: yesPower Electronic Devices and Components, 2022
Considering the switching frequency limit and electromagnetic interference, the selection of high voltage SiC IGBT and SiC MOSFET is confusing due to punch-through effect and bipolar characteristics of SiC IGBT.
Lubin Han   +4 more
doaj   +1 more source

Comment [PDF]

open access: yes, 1983
A chloride-based chemical-vapor-deposition (CVD) process has been successfully used to grow very high quality 3C-SiC epitaxial layers on on-axis α-SiC substrates.
Andersson, Sven   +5 more
core   +3 more sources

Device loss model of a fully SiC based dual active bridge considering the effect of synchronous rectification and deadtime [PDF]

open access: yes, 2018
It is becoming a great interest to employ SiC based power devices in dual active bridge (DAB) converter as an alternative to conventional Si-IGBT, due to its higher switching frequency potential, smaller switching losses as well as the capability to ...
Castellazzi, Alberto, Wang, Zhenyu
core   +1 more source

Energy capability of SiC MOSFETs [PDF]

open access: yes2016 28th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2016
The superior electrical and thermal properties of silicon carbide (SiC) allow further shrinking of the active area of future power semiconductor devices. A lower boundary of the die size can be obtained from the thermal impedance required to withstand the high power dissipation during a short-circuit event.
Christian Unger, Martin Pfost
openaire   +2 more sources

Home - About - Disclaimer - Privacy