Results 101 to 110 of about 2,850,351 (204)
Physics-based SS and SSLS variability assessment of microwave devices through efficient sensitivity analysis [PDF]
Bonani, Fabrizio +7 more
core +1 more source
TCAD simulations for radiation-tolerant silicon sensors
Future High Energy Physics experiments require sensors to operate at extreme fluences exceeding1×1017 1 MeV n𝑒𝑞/cm2. Therefore, technologies used for the HL-LHC scenario will be no longerapplicable and novel sensors and readout electronics must be devised.
Morozzi A. +5 more
openaire +2 more sources
This paper explores the design and optimization of the buffer layer in Silicon Carbide (SiC) N-type Gate Commutated Thyristors (GCTs) to enhance low-loss switching and ensure safe operation in ultra high-voltage (over 10 kV) applications.
Qinze Cao +5 more
doaj +1 more source
Design and TCAD Simulation of p+–n+ InAs‐Based TFET
Tunnel field‐effect transistors (TFETs) are promising for ultra‐low‐power electronics, yet their practical adoption is hindered by limited ON‐current and strong sensitivity of band‐to‐band tunneling (BTBT) to geometry, doping, and quantum confinement ...
Muhammad Elgamal +5 more
doaj +1 more source
Novel Step Floating Islands VDMOS with Low Specific on-Resistance by TCAD Simulation. [PDF]
Zhao D +11 more
europepmc +1 more source
Analysis of Nitrogen-Doping Effect on Sub-Gap Density of States in a-IGZO TFTs by TCAD Simulation. [PDF]
Zhu Z +5 more
europepmc +1 more source
A TCAD tool for the simulation of the CVD process based on cellular automata
The development of next-generation VLSI circuits with deep submicron technologies demands fundamental understanding of the wafer surface reaction kinetics.
I. Karafyllidis +2 more
core +1 more source
Wrapping Amorphous Indium-Gallium-Zinc-Oxide Transistors with High Current Density
Amorphous oxide semiconductor transistors with a high current density output are highly desirable for large-area electronics. In this study, wrapping amorphous indium-gallium-zinc-oxide (a-IGZO) transistors are proposed to enhance the current density ...
Jiaxin Liu +6 more
doaj +1 more source
Breakdown Behavior of Metal Contact Positions in GaN HEMT with Nitrogen-Implanted Gate Using TCAD Simulation. [PDF]
Sheu G +4 more
europepmc +1 more source
[[abstract]]"This paper demonstrates electrical degradation due to hot carrier injection (HCI) stress for devices with different bend gate structures by three-dimensional (3D) TCAD simulation.
高立學;Gau, Li-Shiue
core

