Results 191 to 200 of about 8,891 (213)
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Mask-Under-Etch Experiments of Si{110} in TMAH
Engineering Solutions for the Next Millennium. 1999 IEEE Canadian Conference on Electrical and Computer Engineering (Cat. No.99TH8411), 2003This work investigates the etching of {110} silicon at 80°C in TMAH at 25wt% and 12wt%. A wagonwheel pattern having 1" spokes is used, and the under-etched surfaces and inclination angles are observed in detail. Under-etched surfaces are often complex, composed of 2 or 3 facets, some smooth and some rough.
A. Pandy, L.M. Landsberger, M. Kahrizi
openaire +1 more source
Metal purifier for TMAH developer solution
Advances in Patterning Materials and Processes XL, 2023Jinhong Yu, Robb Fang, Yoshiaki Yamada
openaire +1 more source
Oxidative degradation of TMAH solution with UV persulfate activation
Chemical Engineering Journal, 2014Chi-Wei Wang, Chenju Liang
exaly

