Results 181 to 190 of about 8,891 (213)

An Experimental Study of TMAH Etching Silicon for MEMS

First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 2007
In the process of Micro-Electrical-Mechanical System (MEMS), the anisotropic wet chemical etching rate of the silicon wafer is very important for fabricating MEMS to determine the fabricating method, processing and etching time. The etching rates of the silicon wafer in the TMAH solution with the different temperature are obtained in this paper.
Feiyan Chen, Guoqing Hu, Baihai Wu
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On hillocks generated during anisotropic etching of Si in TMAH

Journal of Microelectromechanical Systems, 1996
Hillocks on etched Si{100} surfaces produced by anisotropic etching are a common irritant in the creation of micromachined devices. Close inspection of typical pyramidal hillock shapes reveals that they are usually bounded by convex -directed edges and {111} or near-{111} planes.
L.M. Landsberger, S. Naseh, M. Kahrizi, M. Paranjape   +3 more
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Effect of TMAH on rheological behavior of SiC aqueous suspension

Journal of the European Ceramic Society, 2004
Tetramethyl ammonium hydroxide (TMAH) was used as dispersant for SiC aqueous suspension. The effects of dispersant concentration and pH on the rheological behavior of SiC aqueous suspension were studied. TMAH improves dispersion by increasing the negative zeta potential of SiC particles. The recommended amount of TMAH is 0.6 wt.% in order to obtain the
Wei Li, Ping Chen, Mingyuan Gu, Yanping Jin   +3 more
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A study of the TMAH based clean performance on advanced photomask

Photomask Technology 2018, 2018
As semiconductor devices become extremely integrated and their geometry continues to shrink, even slight critical dimension (CD) move or phase decay during photomask cleaning may have a negative impact on the CD uniformity performance of photomask. In addition, the printing of sub-resolution assist-features (SRAF) on photomask becomes the main limiting
Jian Shen, Wei Jiang, Fei Xu, Max Lu, Ming Chen, Eric Tian, Alan Li, Fen Xue, Irene Shi   +8 more
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Si and SiGe Alloys Wet Etching Using TMAH Chemistry

ECS Transactions, 2013
From MEMS to CMOS applications, silicon wet anisotropic etching is nowadays considered as an interesting alternative to face new and various technological challenges. This paper focuses on the TMAH chemistry and its use for Si and Si1-xGex alloys etching.
Virginie Loup, Laurence Gabette, Marie-Christine Roure, Riadh Kachtouli, Marine Jourdan, Pascal Besson, Sebastien Petitdidier   +6 more
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Anisotropic etching of surfactant-added TMAH solution

Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291), 1999
The anisotropic silicon etching characteristics of surfactant-added tetramethyl ammonium hydroxide (TMAH) solution were investigated. It was found that the etch rate of the [110] crystal plane abruptly decreases by more than one order of magnitude and that the etch rate ratio of the etch rate of the [100] crystal plane to the etch rate of the [110 ...
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High-performance PIN photodiodes on TMAH thinned silicon wafers

Microelectronics Journal, 2008
The electro-optical characteristics of PIN photodiodes fabricated on high-resistivity silicon substrates locally thinned by bulk micromachining techniques are discussed. Experimental results and numerical simulations demonstrate that devices fabricated by the proposed approach have leakage current, quantum efficiency and speed performance comparable to
Gian-Franco Dalla Betta, S. Ronchin, A. Zoboli, Nicola Zorzi   +3 more
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An efficient treatment technique for TMAH wastewater by catalytic oxidation

Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130), 2001
Developers used in photolithography contain toxic tetramethylammoniumhydroxide (TMAH) and this creates a problem of how to properly treat developer wastewater. We have developed a TMAH wastewater treatment technique that consists of a combination of two novel decomposition processes: pyrolyzing TMAH to TMA and decomposing TMA to N/sub 2/, H/sub 2/O ...
K. Hirano, J. Okamura, T. Taira, K. Sano, A. Toyoda, M. Ikeda   +5 more
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Techniques for the analysis of Cl^-ion in TMAH

SPIE Proceedings, 1998
Fabricating integrated circuits with increasingly smaller elements mandates that the chlorine ion contents in 2.38% TMAH to be under the 50 ppb level. Previously, the interference from TMAH inhibited the analysis of chlorine ion in TMAH by ion chromatography.
Bang-Chein Ho, Mong-Ling Chang, Yu-Ping Lin   +2 more
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Silicon Etching Characteristics in Modified TMAH Solution

2019
In the present work, we have studied the etching characteristics of Si{100} and Si{110} in modified low concentration TMAH solution by adding different concentrations of NH2OH. The etch rate of silicon and thermal oxide, and etched surface morphology, which are important parameters to be known in the fabrication of MEMS structures using silicon wet ...
Veerla Swarnalatha, Avvaru Venkata Narasimha Rao, Prem Pal   +2 more
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