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Characterization of Inter-Cell Interference in 3D NAND Flash Memory
IEEE Transactions on Circuits and Systems I: Regular Papers, 2021We characterize inter-cell interference in commercial three-dimensional NAND flash memory. By writing random data into 3D NAND and collecting sample means and sample variances of cell values corresponding to a particular set of input values in fixed relative neighboring cell locations, it is shown that the interference coming from any target cell ...
Sukkwang Park, Jaekyun Moon
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2018
Nowadays, Solid State Drives consume an enormous amount of NAND Flash memories [1] causing a restless pressure on increasing the number of stored bits per mm2. Planar memory cells have been scaled for decades by improving process technology, circuit design, programming algorithms [2], and lithography.
Rino Micheloni +2 more
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Nowadays, Solid State Drives consume an enormous amount of NAND Flash memories [1] causing a restless pressure on increasing the number of stored bits per mm2. Planar memory cells have been scaled for decades by improving process technology, circuit design, programming algorithms [2], and lithography.
Rino Micheloni +2 more
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3D Stacked NAND Flash Memories
2016Market request for bigger and cheaper NAND Flash memories triggers continuous research activity for cell size shrinkage. For many years, workarounds for all the scalability issues of planar Flash memories have been found. Some examples are the improved programming algorithms for controlling electrostatic interference between adjacent cells [6], and the
Rino Micheloni, Luca Crippa
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A cell current compensation scheme for 3D NAND FLASH memory
2015 IEEE Asian Solid-State Circuits Conference (A-SSCC), 2015The 3D NAND, so-called vertical NAND has cell Vt degradation especially in low temperature, and it affects cell Vt distribution and shift when NAND operates. To solve this problem, the temperature compensation scheme by ATS(Analog Temp Sensor) using CTAT circuit has proposed.
Sungwook Choi +7 more
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Microscopic Physical Origin of Charge Traps in 3D NAND Flash Memories
Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials, 2022Abstract We performed the first-principles calculations for a nitrogen vacancy (V N) and hydrogen(H) atom in β-Si3N4 to clarify the atomistic origin of charge traps in silicon nitride (SiN) layers and charge-trapping mechanism used for 3D NAND flash memories.
Fugo Nanataki +5 more
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Optimization of Performance and Reliability in 3D NAND Flash Memory
IEEE Electron Device Letters, 20203D NAND Flash with high storage capacity is in great demand for several technologies, which requires high performance and good reliability at the same time. Therefore, it is proposed to adjust the tunnel layer by changing the first SiO2 (O1) layer thickness near poly Si channel in the tunnel layer based on SiO2/SiOxNy/SiO2 structure.
Yingjie Ouyang +5 more
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Characteristics of Junctionless Charge Trap Flash Memory for 3D Stacked NAND Flash
Journal of Nanoscience and Nanotechnology, 2013The electrical characteristics of tunnel barrier engineered-charge trap flash (TBE-CTF) memory devices with junctionless (JL) source and drain (S/D) were investigated. The JL structure is composed of an n(+)-poly-Si based ultra-thin channel and S/D with identical doping concentrations.
Jinho, Oh +3 more
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3D Charge Trap NAND Flash Memories
2016This chapter starts off with 2 vertical channel architectures named BiCS (Bit Cost Scalable) and P-BiCS (Pipe-Shaped BiCS), respectively. BiCS was proposed for the first time by Toshiba in 2007, and another version called P-BiCS was presented in 2009 to improve retention, source selector performances and source line resistance.
Luca Crippa, Rino Micheloni
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3D Floating Gate NAND Flash Memories
2016Planar NAND Flash memories (commercially available) are based on Floating Gate, which has been developed and engineered for many decades. Therefore, there have been many attempts to develop 3D Floating Gate cells in order to re-use all the know-how cumulated over time.
Rino Micheloni, Luca Crippa
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Study on cell shape in 3D NAND flash memory
2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC), 2015All kinds of cell structures are appeared in 3D NAND flash technologies and all seem to be promising. In this paper, detail comparisons among the cell structures of them are presented. The theoretical derivation and simulation results both support that the cylindrical cell structure has better program/erase speed and memory window.
Wei Feng, Nine Deng
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