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Introduction to 3D NAND Flash Memories

2022
Rino Micheloni   +2 more
openaire   +1 more source

Accelerating Sub-Block Erase in 3D NAND Flash Memory

2021 IEEE 39th International Conference on Computer Design (ICCD), 2021
Hongbin Gong, Zhirong Shen, Jiwu Shu
openaire   +1 more source

Improving 3D NAND Flash Memories Reliability: a Cross-Layer Perspective

2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
The 3D NAND Flash memory technology is the main building block of storage architectures such as multimedia cards and Solid-State Drives. Applications ranging from mobile to high-performance computing are continuously calling for an increased storage density, requiring massive scaling efforts at the device and array level.
Zambelli C., Micheloni R.
openaire   +1 more source

Trends and Future Challenges of 3D NAND Flash Memory

2023 IEEE International Memory Workshop (IMW), 2023
Sun Il Shim, Jaehoon Jang, Jaihyuk Song
openaire   +1 more source

Enabling 3D NAND Trench Cells for Scaled Flash Memories

2023 IEEE International Memory Workshop (IMW), 2023
S. Rachidi   +8 more
openaire   +1 more source

Synaptic Devices Based on 3D-Semicircular NAND Flash Memory

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials, 2022
Seongbin Oh   +4 more
openaire   +1 more source

In-Memory Approximate Computing Architecture Based on 3D-NAND Flash Memories

2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2022
Po-Hao Tseng   +8 more
openaire   +1 more source

A Review of Program disturb of 3D NAND Flash Memory

2023 24th International Conference on Electronic Packaging Technology (ICEPT), 2023
Bojie Lou   +4 more
openaire   +1 more source

Layer-to-Layer Endurance Variation of 3D NAND Flash Memory

2022 IEEE International Reliability Physics Symposium (IRPS), 2022
Md Raquibuzzaman   +3 more
openaire   +1 more source

A Dynamic Huffman Coding Method for Reliable TLC NAND Flash Memory

ACM Transactions on Design Automation of Electronic Systems, 2021
Chin-Hsien Wu
exaly  

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