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3D VG-Type NAND Flash Memories

2016
The common feature among the different 3D NAND solutions is constituted by very deep vertical (z direction) etching steps that define the Flash cells geometries simultaneously. Transistor geometries are formed by the deep trench through a multiple polysilicon/oxide stack.
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Characterization and Analysis of Bit Errors in 3D TLC NAND Flash Memory

2019 IEEE International Reliability Physics Symposium (IRPS), 2019
3D NAND flash memory has entered dynamically into the space of enterprise server and storage systems, offering significantly higher capacity and better endurance than the latest 2D technology node. Moreover, the advancements in vertical stacking, cell design and program/read algorithms, have also enabled TLC 3D NAND flash with enterprise-level ...
Nikolaos Papandreou   +9 more
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Impact of etch angles on cell characteristics in 3D NAND flash memory

Microelectronics Journal, 2018
Abstract We investigated the impact of etch angles on cell characteristics of 3D NAND flash memory structures. The cell characteristics were extracted from simulations with an empirical etch profile, which was analyzed through comparisons to completely vertical conditions.
Young-Taek Oh   +6 more
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Vertical-channel stacked array (VCSTAR) for 3D NAND flash memory

2011 International Semiconductor Device Research Symposium (ISDRS), 2011
Abstract A novel three-dimensional (3D) NAND flash memory, VCSTAR (Vertical-Channel STacked ARray), is investigated. The proposed device is a vertical channel structure having stacked word-lines to achieve high memory density without shrinking cell channel length.
Se Hwan Park   +4 more
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Multilevel In-Memory-Searching in 3D NAND-Flash Memory

Extended Abstracts of the 2022 International Conference on Solid State Devices and Materials, 2022
Po Hao Tseng   +9 more
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Introduction to 3D NAND Flash Memories

2022
Rino Micheloni   +2 more
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In-Memory Approximate Computing Architecture Based on 3D-NAND Flash Memories

2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2022
Po-Hao Tseng   +8 more
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Layer-to-Layer Endurance Variation of 3D NAND Flash Memory

2022 IEEE International Reliability Physics Symposium (IRPS), 2022
Md Raquibuzzaman   +3 more
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Enabling 3D NAND Trench Cells for Scaled Flash Memories

2023 IEEE International Memory Workshop (IMW), 2023
S. Rachidi   +8 more
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Accelerating Sub-Block Erase in 3D NAND Flash Memory

2021 IEEE 39th International Conference on Computer Design (ICCD), 2021
Hongbin Gong, Zhirong Shen, Jiwu Shu
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