Results 41 to 50 of about 1,697,138 (284)
Progress in EUV resist screening by interference lithography for high-NA lithography [PDF]
The introduction of novel photoresists is a critical enabler of future technology nodes, including the upcoming high-NA EUVL deployment. The development of EUV materials is investigated within the scope of a resist screening program between ASML and PSI.
Vockenhuber, M. (author) +6 more
core +1 more source
Solvent immersion nanoimprint lithography of fluorescent conjugated polymers [PDF]
This work was supported by Engineering and Physical Sciences Research Council (EPSRC) Programme Grants: (EP1J01771X), (EP/K00042X), (EP/J5005491), and (EP/K503162).Solvent immersion imprint lithography (SIIL) was used to directly nanostructure conjugated
J. R. Y. Stevenson +11 more
core +1 more source
As the lithography process continues to become more rigorous in advanced technology nodes, the model-based optical proximity correction (MBOPC), as a core component within computational lithography, necessitates the development of highly precise ...
Jinhao Zhu +6 more
doaj +1 more source
Mass production-enabled computational spectrometers based on multilayer thin films
Multilayer thin film (MTF) filter arrays for computational spectroscopy are fabricated using stencil lithography. The MTF filter array is a 6 × 6 square grid, and 169 identical arrays are fabricated on a single wafer.
Cheolsun Kim +3 more
doaj +1 more source
Fabrication of macroporous polysilicon by using nanosphere lithography
Nanosphere lithography (NSL) has been demonstrated to be a feasible, alternative technique for the fabrication of macroporous polysilicon. The diameter of the pore can be controlled by RIE of the fabricated nanospheres template using Ar/O gas mixtures at
Melvin, T., Chau, C.F.
core +2 more sources
Efficient fullwave-guided optical proximity correction [PDF]
The continuous shrinking of process nodes in lithography intensifies wave effects and causes mismatches between the designed mask patterns and the actual features printed on the wafer.
Zekui Jia +4 more
doaj +1 more source
Guest Editorial: Computational Lithography [PDF]
This PDF file contains the editorial “Guest Editorial: Computational Lithography” for JM3 Vol.
openaire +1 more source
Progress in EUV resist screening towards the deployment of high-NA lithography [PDF]
The development of EUV resists is one of the major challenges for the deployment of high-NA EUV lithography, which is on the roadmap for high-volume manufacturing of future semiconductor technology nodes.
Vockenhuber, M. (author) +7 more
core +1 more source
Microscale and nanoscale strain mapping techniques applied to creep of rocks [PDF]
Usually several deformation mechanisms interact to accommodate plastic deformation. Quantifying the contribution of each to the total strain is necessary to bridge the gaps from observations of microstructures, to geomechanical descriptions, to ...
A. Quintanilla-Terminel +3 more
doaj +1 more source
Layout pattern analysis and coverage evaluation in computational lithography
In advanced semiconductor technology nodes, the model accuracy of optical proximity correction (OPC) is the key for integrated circuit (IC) chip mask tape out, yield ramp up, and product time-to-market. An accurate model means a small prediction error for the full chip layout.
Yaobin Feng +6 more
openaire +2 more sources

