Results 51 to 60 of about 35,076 (191)

Anisotropic Etching of Graphite and Graphene in a Remote Hydrogen Plasma [PDF]

, 2017
We investigate the etching of a pure hydrogen plasma on graphite samples and graphene flakes on SiO$_2$ and hexagonal Boron-Nitride (hBN) substrates. The pressure and distance dependence of the graphite exposure experiments reveals the existence of two ...
Camenzind, Timothy N., Hug, Dorothee, Kalyoncu, Yemliha B., Marot, Laurent, Rehmann, Mirko K., Taniguchi, Takashi, Watanabe, Kenji, Zihlmann, Simon, Zumbühl, Dominik M.   +8 more
core   +2 more sources

Fabrication of High-Density Out-of-Plane Microneedle Arrays with Various Heights and Diverse Cross-Sectional Shapes

Nano-Micro Letters, 2021
Out-of-plane microneedle structures are widely used in various applications such as transcutaneous drug delivery and neural signal recording for brain machine interface.
Hyeonhee Roh, Young Jun Yoon, Jin Soo Park, Dong-Hyun Kang, Seung Min Kwak, Byung Chul Lee, Maesoon Im   +6 more
doaj   +1 more source

Holistic approach to dissolution kinetics : linking direction-specific microscopic fluxes, local mass transport effects and global macroscopic rates from gypsum etch pit analysis [PDF]

, 2013
Dissolution processes at single crystal surfaces often involve the initial formation and expansion of localized, characteristic (faceted) etch-pits at defects, in an otherwise comparatively unreactive surface.
Abendan, Alonso-Azcárate, Alonso-Azcárate, Arvidson, Bard, Binnig, Blum, Blum, Bosbach, Bosbach, Bosbach, Brantley, Brown, Buchanan, Burns, Burt, Cama, Cama, Chen, Chow, Chow, Christoffersen, Colombani, Colombani, Compton, Compton, Compton, Dove, Engstrom, Fan, Fleischmann, Ford, Forster, Fujiwara, Gasperino, Hall, Hartman, Heinze, Hong, Howell, Jeschke, Jeschke, Jones, Jones, Jordan, Kowacz, Lasaga, Lasaga, Levich, Liu, Lüttge, Lüttge, Lüttge, MacInnis, Macpherson, Macpherson, Macpherson, Macpherson, Martin A. Edwards, Massimo Peruffo, Mbogoro, McGeouch, McGeouch, Michael M. Mbogoro, Morel, Morse, Nancollas, Olhoeft, Orton, Pachon-Rodriguez, Patrick R. Unwin, Peltonen, Ruiz-Agudo, Ruiz-Agudo, Ruiz-Agudo, Sangwal, Schecher, Schofield, Singh, Stumm, Svensson, Tang, Tang, Tang, Taylor, Titiz-Sargut, Unwin, Unwin, Van Driessche, Van Rosmalen, Vanysek, Vavouraki, Wang, White, Wightman, Zhang   +95 more
core   +1 more source

Cryogenic silicon surface ion trap [PDF]

, 2014
Trapped ions are pre-eminent candidates for building quantum information processors and quantum simulators. They have been used to demonstrate quantum gates and algorithms, quantum error correction, and basic quantum simulations.
Blatt, Rainer, Brownnutt, Michael, Edlinger, Johannes, Kumph, Muir, Lakhmanskiy, Kirill, Niedermayr, Michael, Partel, Stefan   +6 more
core   +1 more source

A Low-Cost CMOS-MEMS Piezoresistive Accelerometer with Large Proof Mass

Sensors, 2011
This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 μm CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresistive
Mohd Haris Md Khir, Hongwei Qu, Peng Qu
doaj   +1 more source

Direct printing of polymer microstructures on flat and spherical surfaces using a letterpress technique [PDF]

, 2002
We have developed a letterpress technique capable of printing polymer films with micrometer scale feature sizes onto flat or spherically shaped nonporous substrates.
Miller, Scott M., Troian, Sandra M., Wagner, Sigurd   +2 more
core   +1 more source

A Thorough Review of Emerging Technologies in Micro- and Nanochannel Fabrication: Limitations, Applications, and Comparison

Micromachines
In recent years, the field of micro- and nanochannel fabrication has seen significant advancements driven by the need for precision in biomedical, environmental, and industrial applications.
Koosha Karimi, Ali Fardoost, Nikhil Mhatre, Jay Rajan, David Boisvert, Mehdi Javanmard   +5 more
doaj   +1 more source

Fabrication of Through via Holes in Ultra-Thin Fused Silica Wafers for Microwave and Millimeter-Wave Applications

Micromachines, 2018
Through via holes in fused silica are a key infrastructure element of microwave and millimeter-wave circuits and 3D integration. In this work, etching through via holes in ultra-thin fused silica wafers using deep reactive-ion etching (DRIE) and laser ...
Xiao Li, King Yuk Chan, Rodica Ramer
doaj   +1 more source

Critical components in 0.14 THz communication systems

, 2012
In the super-heterodyne terahertz communication system, the proper design of the critical components like mixers and filters are of great importance for enhancing its performance. In this work, some issues on our newly developed system setup design for 0.
Shan, Guangcun, Shek, Chan-Hung, Zhao, Xinghai, Zhu, Haoshen   +3 more
core   +1 more source

Characterization of GaN Nanorods Fabricated Using Ni Nanomasking and Reactive Ion Etching: A Top-Down Approach [PDF]

, 2013
Large thermal mismatch between GaN surface and sapphire results in compressive stress in Gallium Nitride (GaN) layer which degrades the device performance.
Christiansen, S., Kumar, Ashutosh, Latzel, Michael, Singh, R., Tessarek, C.   +4 more
core