Results 61 to 70 of about 35,175 (290)

Fabrication of High-Density Out-of-Plane Microneedle Arrays with Various Heights and Diverse Cross-Sectional Shapes

Nano-Micro Letters, 2021
Out-of-plane microneedle structures are widely used in various applications such as transcutaneous drug delivery and neural signal recording for brain machine interface.
Hyeonhee Roh, Young Jun Yoon, Jin Soo Park, Dong-Hyun Kang, Seung Min Kwak, Byung Chul Lee, Maesoon Im   +6 more
doaj   +1 more source

Holistic approach to dissolution kinetics : linking direction-specific microscopic fluxes, local mass transport effects and global macroscopic rates from gypsum etch pit analysis [PDF]

, 2013
Dissolution processes at single crystal surfaces often involve the initial formation and expansion of localized, characteristic (faceted) etch-pits at defects, in an otherwise comparatively unreactive surface.
Abendan, Alonso-Azcárate, Alonso-Azcárate, Arvidson, Bard, Binnig, Blum, Blum, Bosbach, Bosbach, Bosbach, Brantley, Brown, Buchanan, Burns, Burt, Cama, Cama, Chen, Chow, Chow, Christoffersen, Colombani, Colombani, Compton, Compton, Compton, Dove, Engstrom, Fan, Fleischmann, Ford, Forster, Fujiwara, Gasperino, Hall, Hartman, Heinze, Hong, Howell, Jeschke, Jeschke, Jones, Jones, Jordan, Kowacz, Lasaga, Lasaga, Levich, Liu, Lüttge, Lüttge, Lüttge, MacInnis, Macpherson, Macpherson, Macpherson, Macpherson, Martin A. Edwards, Massimo Peruffo, Mbogoro, McGeouch, McGeouch, Michael M. Mbogoro, Morel, Morse, Nancollas, Olhoeft, Orton, Pachon-Rodriguez, Patrick R. Unwin, Peltonen, Ruiz-Agudo, Ruiz-Agudo, Ruiz-Agudo, Sangwal, Schecher, Schofield, Singh, Stumm, Svensson, Tang, Tang, Tang, Taylor, Titiz-Sargut, Unwin, Unwin, Van Driessche, Van Rosmalen, Vanysek, Vavouraki, Wang, White, Wightman, Zhang   +95 more
core   +1 more source

Intermediate Resistive State in Wafer‐Scale Vertical MoS2 Memristors Through Lateral Silver Filament Growth for Artificial Synapse Applications

Advanced Functional Materials, EarlyView.
In MOCVD MoS2 memristors, a current compliance‐regulated Ag filament mechanism is revealed. The filament ruptures spontaneously during volatile switching, while subsequent growth proceeds vertically through the MoS2 layers and then laterally along the van der Waals gaps during nonvolatile switching.
Yuan Fa, Milan Buttberg, Ke Ran, Rana Walied Ahmad, Dennis Braun, Lukas Völkel, Jimin Lee, Sofía Cruces, Bart Macco, Bárbara Canto, Holger Lerch, Thorsten Wahlbrink, Holger Kalisch, Michael Heuken, Andrei Vescan, Joachim Mayer, Zhenxing Wang, Ilia Valov, Stephan Menzel, Max C. Lemme   +19 more
wiley   +1 more source

Cryogenic silicon surface ion trap [PDF]

, 2014
Trapped ions are pre-eminent candidates for building quantum information processors and quantum simulators. They have been used to demonstrate quantum gates and algorithms, quantum error correction, and basic quantum simulations.
Blatt, Rainer, Brownnutt, Michael, Edlinger, Johannes, Kumph, Muir, Lakhmanskiy, Kirill, Niedermayr, Michael, Partel, Stefan   +6 more
core   +1 more source

Integration of Low‐Voltage Nanoscale MoS2 Memristors on CMOS Microchips

Advanced Functional Materials, EarlyView.
This article presents the first monolithic integration of nanoscale MoS2‐based memristors into the back‐end‐of‐line of foundry‐fabricated CMOS microchips in a one‐transistor‐one‐resistor (1T1R) architecture. The MoS2‐based 1T1R cells exhibit forming‐free, nonvolatile resistive switching with ultra‐low operating voltages, low cycle‐to‐cycle variability ...
Jimin Lee, Sofía Cruces, Xiaohua Liu, Yang Chen, Vasilis A. Maroufidis, Janghyun Jo, Lukas Völkel, Dennis Braun, Michael Möller, Leon Brackmann, Holger Kalisch, Michael Heuken, Andrei Vescan, Rafal E. Dunin‐Borkowski, Joachim Mayer, Stefan Wiefels, Max C. Lemme   +16 more
wiley   +1 more source

A Low-Cost CMOS-MEMS Piezoresistive Accelerometer with Large Proof Mass

Sensors, 2011
This paper reports a low-cost, high-sensitivity CMOS-MEMS piezoresistive accelerometer with large proof mass. In the device fabricated using ON Semiconductor 0.5 μm CMOS technology, an inherent CMOS polysilicon thin film is utilized as the piezoresistive
Mohd Haris Md Khir, Hongwei Qu, Peng Qu
doaj   +1 more source

Direct printing of polymer microstructures on flat and spherical surfaces using a letterpress technique [PDF]

, 2002
We have developed a letterpress technique capable of printing polymer films with micrometer scale feature sizes onto flat or spherically shaped nonporous substrates.
Miller, Scott M., Troian, Sandra M., Wagner, Sigurd   +2 more
core   +1 more source

From Wafers to Electrodes: Transferring Automatic Optical Inspection (AOI) for Multiscale Characterization of Smart Battery Manufacturing

Advanced Functional Materials, EarlyView.
Automat optical inspection (AOI) techniques in semiconductor fabrication can be leveraged in battery manufacturing, enabling scalable detection and analysis of electrode‐ and cell‐level imperfections through AI‐driven analytics and a digital‐twin framework.
Jianyu Li, Ertao Hu, Wei Wei, Feifei Shi
wiley   +1 more source

A Thorough Review of Emerging Technologies in Micro- and Nanochannel Fabrication: Limitations, Applications, and Comparison

Micromachines
In recent years, the field of micro- and nanochannel fabrication has seen significant advancements driven by the need for precision in biomedical, environmental, and industrial applications.
Koosha Karimi, Ali Fardoost, Nikhil Mhatre, Jay Rajan, David Boisvert, Mehdi Javanmard   +5 more
doaj   +1 more source

Fabrication of Through via Holes in Ultra-Thin Fused Silica Wafers for Microwave and Millimeter-Wave Applications

Micromachines, 2018
Through via holes in fused silica are a key infrastructure element of microwave and millimeter-wave circuits and 3D integration. In this work, etching through via holes in ultra-thin fused silica wafers using deep reactive-ion etching (DRIE) and laser ...
Xiao Li, King Yuk Chan, Rodica Ramer
doaj   +1 more source