Reduced Etch Lag and High Aspect Ratios by Deep Reactive Ion Etching (DRIE) [PDF]
Micromachines, 2021 Deep reactive ion etching (DRIE) with the Bosch process is one of the key procedures used to manufacture micron-sized structures for MEMS and microfluidic applications in silicon and, hence, of increasing importance for miniaturisation in biomedical ...
Michael S. Gerlt +4 more
doaj +7 more sources
Deep Reactive Ion Etching (DRIE) of High Aspect Ratio SiC Microstructures Using a Time-Multiplexed Etch-Passivate Process [PDF]
Materials Science Forum, 2006 High aspect ratio silicon carbide (SiC) microstructures are needed for microengines and other harsh environment micro-electro-mechanical systems (MEMS). Previously, deep reactive ion etching (DRIE) of low aspect ratio (AR ≤1) deep (>100 *m) trenches in SiC has been reported. However, existing DRIE processes for SiC are not well-suited for definition
Laura J. Evans, Glenn M. Beheim
openaire +4 more sources
On-Chip Non-Dispersive Infrared CO2 Sensor Based on an Integrating Cylinder
Sensors, 2019 In this paper, we propose a novel, miniaturized non-dispersive infrared (NDIR) CO2 sensor implemented on a silicon chip. The sensor has a simple structure, consisting of a hollow metallic cylindrical cavity along with access waveguides.
Xiaoning Jia +3 more
doaj +4 more sources
Optimization Method for the Synergistic Control of DRIE Process Parameters on Sidewall Steepness and Aspect Ratio [PDF]
MicromachinesDeep Reactive Ion Etching (DRIE), as a key process in silicon micromachining, remains constrained in high-precision applications by sidewall angle deviation and aspect ratio limitations.
Dandan Wang +8 more
doaj +2 more sources
AI-driven feature recognition of SEM profiles in deep reactive ion etching based on physics-constrained variational autoencoder [PDF]
Microsystems & NanoengineeringDeep reactive ion etching (DRIE) is critical for fabricating high-aspect-ratio structures in microelectromechanical systems (MEMS), yet its complex, parameter-dependent process poses significant optimization challenges.
Fang Wang +6 more
doaj +2 more sources
Fabrication of Air Cavity Structures Using DRIE for Acoustic Signal Confinement in FBAR Devices [PDF]
MicromachinesAcoustic energy penetrates into the Si substrate at cavity boundaries. Due to this, the air cavity-based bulk acoustic resonators experience higher harmonic mode, parasitic resonance, and spurious mode.
Raju Patel +3 more
doaj +2 more sources
New DRIE-Patterned Electrets for Vibration Energy Harvesting
EPJ Web of Conferences, 2012 This paper is about a new manufacturing process aimed at developing stable SiO2/Si3N4 patterned electrets using a Deep Reactive Ion Etching (DRIE) step for an application in electret-based Vibration Energy Harvesters (e-VEH).
Chaillout J.-J. +3 more
doaj +3 more sources
A Fabrication Method for Realizing Vertically Aligned Silicon Nanowires Featuring Precise Dimension Control [PDF]
SensorsSilicon nanowires (SiNWs) have garnered considerable attention in the last few decades owing to their versatile applications. One extremely desirable aspect of fabricating SiNWs is controlling their dimensions and alignment.
Sourav Mukherjee +3 more
doaj +2 more sources
Microfabrication Technologies for Interaction Circuits of THz Vacuum Electronic Devices [PDF]
MicromachinesAdvances in manufacturing technology are allowing for the realization of interaction circuit with microstructures. The capability to produce small circuit structures is allowing new opportunities for vacuum electronic devices producing terahertz (THz ...
Xinghui Li, Jinjun Feng
doaj +2 more sources
The Improvement of Performance through Minimizing Scallop Size in MEMS Based Micro Wind Turbine
Micromachines, 2021 In this paper we report on the improvement of performance by minimizing scallop size through deep reactive-ion etching (DRIE) of rotors in micro-wind turbines based on micro-electro-mechanical systems (MEMS) technology.
Young Chan Choi +3 more
doaj +1 more source