Results 11 to 20 of about 6,778 (181)
Effect of process parameters on the surface morphology and mechanical performance of silicon structures after deep reactive ion etching (DRIE) [PDF]
Journal of Microelectromechanical Systems, 2002 The ability to predict and control the influence of process parameters during silicon etching is vital for the success of most MEMS devices. In the case of deep reactive ion etching (DRIE) of silicon substrates, experimental results indicate that etch performance as well as surface morphology and post-etch mechanical behavior have a strong dependence ...
Chen, Kuo-Shen +3 more
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Nano-Micro Letters, 2021 Out-of-plane microneedle structures are widely used in various applications such as transcutaneous drug delivery and neural signal recording for brain machine interface.
Hyeonhee Roh +6 more
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Large-scale Patterning of Hydrophobic Silicon Nanostructure Arrays Fabricated by Dual Lithography and Deep Reactive Ion Etching [PDF]
Nano-Micro Letters, 2013 We describe a simple but efficient technique to fabricate large-scale arrays of highly ordered silicon nanostructures. By coupling dual lithography using light of 351.1 nm wavelength with deep reactive ion etching (DRIE), silicon nanostructures of ...
Chengyu Jiang +3 more
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Recent Advances in Reactive Ion Etching and Applications of High-Aspect-Ratio Microfabrication
Micromachines, 2021 This paper reviews the recent advances in reaction-ion etching (RIE) for application in high-aspect-ratio microfabrication. High-aspect-ratio etching of materials used in micro- and nanofabrication has become a very important enabling technology ...
Michael Huff
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Micro and Nano Systems Letters, 2020 Deep reactive-ion etching (DRIE) is commonly used for high aspect ratio silicon micromachining. However, scalloping, which is the result of the alternating Bosch process of DRIE, can cause many problems in the subsequent process and degrade device ...
Jin Soo Park +7 more
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Optimization of deep reactive ion etching for microscale silicon hole arrays with high aspect ratio
Micro and Nano Systems Letters, 2022 During deep reactive ion etching (DRIE), microscale etch masks with small opening such as trenches or holes suffer from limited aspect ratio because diffusion of reactive ions and free radicals become progressively difficult as the number of DRIE cycle ...
Taeyeong Kim, Jungchul Lee
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Metasurface Fabrication by Cryogenic and Bosch Deep Reactive Ion Etching
Micromachines, 2021 The research field of metasurfaces has attracted considerable attention in recent years due to its high potential to achieve flat, ultrathin optical devices of high performance. Metasurfaces, consisting of artificial patterns of subwavelength dimensions,
Angela M. Baracu +7 more
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Actuators, 2023 Anode bonding is a widely used method for fabricating devices with suspended structures, and this approach is often combined with deep reactive-ion etching (DRIE) for releasing the device; however, the DRIE process with a glass substrate can potentially ...
Junduo Wang +4 more
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A two-level prediction model for deep reactive ion etch (DRIE) [PDF]
18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005., 2005 The authors contribute a quantitative and systematic model to capture etch non-uniformity in deep reactive ion etch of MEMS devices. Non-uniformity depends on uneven distributions of ion and neutral species at the wafer level, and local consumption at the die level.
Taylor, Hayden K. +4 more
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Etch mechanism of an Al2O3 hard mask in the Bosch process
Micro and Nano Engineering, 2022 The etching of high aspect ratio structures in silicon via the Bosch process is essential in modern technologies such as microelectromechanical systems (MEMS) and through‑silicon vias (TSV) fabrication.
Martin Drost +7 more
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