Results 21 to 30 of about 6,778 (181)

Three-Dimensional Heterogeneous Bonding for High-Density and Low-Noise TMR Sensing Arrays. [PDF]

Adv Sci (Weinh)
This study demonstrates a three‐dimensional heterogeneous bonding approach to fabricate compact TMR sensing units with double junction numbers and improved magnetic performance. Optimized Au─Au bonding and angled etching improve device integrity, noise characteristics, and magnetoresistance.
Han Z, Jin Z, Zhang C, Chen J.
europepmc   +2 more sources

Fabrication of Through via Holes in Ultra-Thin Fused Silica Wafers for Microwave and Millimeter-Wave Applications

Micromachines, 2018
Through via holes in fused silica are a key infrastructure element of microwave and millimeter-wave circuits and 3D integration. In this work, etching through via holes in ultra-thin fused silica wafers using deep reactive-ion etching (DRIE) and laser ...
Xiao Li, King Yuk Chan, Rodica Ramer
doaj   +1 more source

Three-Dimensional Simulation of DRIE Process Based on the Narrow Band Level Set and Monte Carlo Method

Micromachines, 2018
A three-dimensional topography simulation of deep reactive ion etching (DRIE) is developed based on the narrow band level set method for surface evolution and Monte Carlo method for flux distribution.
Jia-Cheng Yu, Zai-Fa Zhou, Jia-Le Su, Chang-Feng Xia, Xin-Wei Zhang, Zong-Ze Wu, Qing-An Huang   +6 more
doaj   +1 more source

Guidelines for etching silicon MEMS structures using fluorine high-density plasmas at cryogenic temperatures [PDF]

, 2002
This paper presents guidelines for the deep reactive ion etching (DRIE) of silicon MEMS structures, employing SF/sub 6//O/sub 2/-based high-density plasmas at cryogenic temperatures.
Boer, Meint J. de, Elwenspoek, Miko, Gardeniers, J.G.E. (Han), Gilde, Melis-Jan, Jansen, Henri V., Roelofs, Gerard, Sasserath, Jay N.   +6 more
core   +2 more sources

Single-Step CMOS Compatible Fabrication of High Aspect Ratio Microchannels Embedded in Silicon

Proceedings, 2017
This paper presents a new method for the CMOS compatible fabrication of microchannels integrated into a silicon substrate. In a single-step DRIE process (Deep Reactive Ion Etching) a network of microchannels with High Aspect Ratio (HAR) up to 10, can be ...
Marta Kluba, Aslihan Arslan, Ronald Stoute, James Muganda, Ronald Dekker   +4 more
doaj   +1 more source

Micromachining of buried micro channels in silicon [PDF]

, 2000
A new method for the fabrication of micro structures for fluidic applications, such as channels, cavities, and connector holes in the bulk of silicon wafers, called buried channel technology (BCT), is presented in this paper.
Berenschot, J.W. (Erwin), Berg, Albert van den, Boer, Meint J. de, Burger, G.J., Elwenspoek, Miko, Gardeniers, J.G.E. (Han), Jansen, Henri V., Tjerkstra, R. Willem   +7 more
core   +3 more sources

An Electrostatic MEMS Roll-Pitch Rotation Rate Sensor with In-Plane Drive Mode

Sensors, 2022
In this paper, we presented a novel electrostatic Roll/Pitch MEMS gyroscope with in-plane drive mode and out-of-plane sense mode. The proposed structure is developed based on a tuning fork gyroscope with decoupled sense mass on each tine that control the
Ahmed Khaled, Ahmed M. Salman, Nawaf S. Aljehani, Ibrahim F. Alzahem, Ridha S. Almikhlafi, Radwan M. Noor, Yasser M. Seddiq, Majed S. Alghamdi, Mostafa Soliman, Mohamed A. E. Mahmoud   +9 more
doaj   +1 more source

3D surface topography and reflectivity of anisotropic etched silicon micromirrors for BioMEMS [PDF]

, 2011
This paper examines wet and dry fabrication of vertical micro-mirrors in (110) silicon for use in an innovative BioMEMS integrating gripping and micro force sensing functionalities.
Le, HR, Lionis, N, Mackay, RE
core   +2 more sources

Plasma removal of Parylene C [PDF]

, 2008
Parylene C, an emerging material in microelectromechanical systems, is of particular interest in biomedical and lab-on-a-chip applications where stable, chemically inert surfaces are desired.
Li, Po-Ying, Meng, Ellis, Tai, Yu-Chong
core   +1 more source

Design of experiment for the optimisation of deep reactive ion etching of silicon inserts for micro-fabrication [PDF]

, 2012
The following paper describes a design of experiments investigation of the deep reactive of pillar structures on a silicon wafer. The etched wafers would subsequently be used as masters for the fabrication of nickel mould inserts for microinjection ...
Alcock, Jeffrey R., Shaw, Christopher P., Wallis, K.   +2 more
core   +1 more source