Results 141 to 150 of about 1,279 (182)
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Journal of Computational Electronics, 2018
This paper proposes a gate-all-around silicon nanowire dopingless field-effect transistor (FET), utilizing a gate-stacked technique. The source and drain regions are formed by employing a charge plasma concept, with the application of appropriate work functions for metal contacts.
Sarabdeep Singh, Ashish Raman
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This paper proposes a gate-all-around silicon nanowire dopingless field-effect transistor (FET), utilizing a gate-stacked technique. The source and drain regions are formed by employing a charge plasma concept, with the application of appropriate work functions for metal contacts.
Sarabdeep Singh, Ashish Raman
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IEEE Transactions on Electron Devices, 2011
In this paper, the effects of device orientation, geometry, and strain (uniaxial and biaxial) on the electrostatic properties of different silicon gate-all-around metal-oxide-semiconductor field-effect transistors are thoroughly investigated. We show how the electron density changes with the device orientation and how it depends on the geometry, size ...
Tienda-Luna I.M. +4 more
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In this paper, the effects of device orientation, geometry, and strain (uniaxial and biaxial) on the electrostatic properties of different silicon gate-all-around metal-oxide-semiconductor field-effect transistors are thoroughly investigated. We show how the electron density changes with the device orientation and how it depends on the geometry, size ...
Tienda-Luna I.M. +4 more
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ECS Meeting Abstracts, 2019
This paper addresses the opportunities and challenges of wet and dry etches in the integration of gate-all-around (GAA) device, which is emerging as a promising solution to replace FinFET [1-3]. For the GAA device fabrication, a quintessential challenge is an isotropic etching of dielectrics, semiconductors, and metals with high selectivity to the ...
Yusuke Oniki +2 more
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This paper addresses the opportunities and challenges of wet and dry etches in the integration of gate-all-around (GAA) device, which is emerging as a promising solution to replace FinFET [1-3]. For the GAA device fabrication, a quintessential challenge is an isotropic etching of dielectrics, semiconductors, and metals with high selectivity to the ...
Yusuke Oniki +2 more
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Gate-All-Around (GAA) NWFET with L g = 10 nm Simulation
2017According to MOSFET scaling rule, the depletion layer formed in the channel of traditional 2D MOSFET near source and drain, the short-channel effect (SCE) has become inevitable along with the scaling of L g dimension.
Yung-Chun Wu, Yi-Ruei Jhan
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Materials characterization for process integration of multi-channel gate all around (GAA) devices
SPIE Proceedings, 2017Multi-channel gate all around (GAA) semiconductor devices march closer to becoming a reality in production as their maturity in development continues. From this development, an understanding of what physical parameters affecting the device has emerged.
Gangadhara Raja Muthinti +19 more
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Compact modeling for gate-all-around nanowire tunneling FETs (GAA NW-tFETs)
2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology, 2012A compact model for gate-all-around (GAA) nanowire tunneling FETs (NW-tFETs) is developed based on ballistic transport and charge balancing approaches. To account for the carrier injection to the channel from source/drain (S/D) regions for NW FETs, the density-of-states (DOS) charge, which results in the so-called quantum capacitance, is introduced and
Zhiping Yu +3 more
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Significant Performance Enhancement in strained channel GaAs Gate-All-Around (GAA) nanowire
2022 IEEE International Women in Engineering (WIE) Conference on Electrical and Computer Engineering (WIECON-ECE), 2022Dev Desai +4 more
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SiGe cantilever channel gate-all-around (GAA) fully depleted (FD) PMOSFET with high-¿ and metal gate
2007 65th Annual Device Research Conference, 2007Scaling the conventional CMOS transistor beyond the 45 nm generation ushers in several fundamental limitations. Control of leakage currents and sustaining electrostatic integrity while maintaining historic enhancements in performance requires such ultra-thin gate-dielectrics and heavily doped bodies that a process window sufficiently large for ...
S.-H. Lee +4 more
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Drain current model for a gate all around (GAA) p–n–p–n tunnel FET
Microelectronics Journal, 2013Abstract A two dimensional drain current model has been proposed for a gate all around silicon p–n–p–n (pocket doped or tunnel source) tunnel field effect transistor (TFET) including the influence of drain voltage and source/drain depletion widths.
Rakhi Narang +3 more
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Challenges and future scope of gate-all-around (GAA) transistors
2023Shobhit Srivastava, Abhishek Acharya
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