Effects of Poly-Si Grain Boundary on Retention Characteristics under Cross-Temperature Conditions in 3-D NAND Flash Memory. [PDF]
An U +6 more
europepmc +1 more source
Memory characteristics of silicon nanowire transistors generated by weak impact ionization. [PDF]
Lim D, Kim M, Kim Y, Kim S.
europepmc +1 more source
Recent Progress of Ferroelectric-Gate Field-Effect Transistors and Applications to Nonvolatile Logic and FeNAND Flash Memory. [PDF]
Sakai S, Takahashi M.
europepmc +1 more source
A Novel Channel Preparation Scheme to Optimize Program Disturbance in Three-Dimensional NAND Flash Memory. [PDF]
You K, Jin L, Jia J, Huo Z.
europepmc +1 more source
Repurposing Si CMOS nonidealities for stochastic and analog image processing. [PDF]
Kwak B +11 more
europepmc +1 more source
CMOS Scaling for the 5 nm Node and Beyond: Device, Process and Technology. [PDF]
Radamson HH +30 more
europepmc +1 more source
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3DNAND GIDL-Assisted Body Biasing for Erase Enabling CMOS under Array (CUA) Architecture
2017 IEEE International Memory Workshop (IMW), 2017The Gate-Induce-Drain-Leakage (GIDL)-assisted body biasing for erase, which is a technique essential to enabling 3DNAND Flash CMOS Under Array architectures, has been extensively studied and successfully optimized to achieve high-performance, reliable erase operation.
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Compact modeling of GIDL-assisted erase in 3-D NAND Flash strings
Journal of Computational Electronics, 2019This paper presents a physics-based compact model able to describe the time dynamics of the erase operation in three-dimensional NAND Flash strings exploiting gate-induced drain leakage at the selector to increase the string potential. The model accurately reproduces all the main phases of the erase operation and allows to calculate the threshold ...
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Improvement of GIDL-assisted Erase by using Surrounded BL PAD Structure for VNAND
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