Results 111 to 120 of about 15,181 (229)
AlGaN/GaN high-electron-mobility transistors (HEMTs) are promising for high-frequency and high-power applications; however, aggressive scaling introduces short-channel effects (SCEs) that degrade electrostatic control of the two-dimensional electron gas (
Debaleen Biswas +4 more
core +1 more source
Research progress on irradiation effect of InP-based high electron mobility transistors
Indium phosphide (InP)-based high electron mobility transistors (HEMTs) have been widely adopted in space communication systems such as satellites, manned spaceflight, and deep space exploration due to their high frequency and gain, and low noise ...
FANG Renfeng +7 more
doaj +1 more source
Effect of fluoride plasma treatment on InAlN/GaN HEMTs
Fluoride plasma treatment similar to that used in AlGaN/GaN HEMTs has been applied to InAlN/GaN HEMTs. Enhancement mode of operation is obtained with a pinch-off voltage shifted by 3 V.
Kohn, E. +21 more
core +1 more source
Precise modeling of gallium nitride (GaN) high-electron mobility transistors (HEMTs) is vital for ensuring reliable and scalable RF circuit design, and efficient characterization of the device behavior.
Ahmad Khusro +2 more
doaj +1 more source
Anomalous output conductance in N-polar GaN-based MIS-HEMTs
We propose that the anomalous output conductance in N-polar GaN MIS-HEMTs was caused by ionization of donor-like traps from a net negative polarization interface.
Speck, James S. +9 more
core +1 more source
Numerical simulation of InN based HEMTs [PDF]
Invented in 1980, High Electron Mobility Transistors(HEMTs) are now widely used in high-frequency electronics. They are fabricated in different material systems and a possible new material for future devices is indium nitride (InN).
VANDEMAELE, MICHIEL
core
High Breakdown Voltage P-GaN Gate HEMTs with Threshold Voltage of 7.1 v
In this study, we proposed an enhanced mode P-GaN/AlGaN/GaN metal-insulator-semiconductor high electron mobility transistors (MIS-HEMTs) by combining thermal oxidation treatment of P-GaN with atomic layer deposition (OTALD) prior to gate metal deposition.
Cui, P +10 more
core +1 more source
Passivation of InGaAs/InAlAs/InP HEMTs using Al2O3 atomic layer deposition
InGaAs/InAlAs/InP HEMTs (InP HEMTs) passivated by Al2O3 atomic layer deposition (ALD) demonstrated improved DC performance compared to Si3N4 plasma enhanced chemical vapour deposition (PECVD).
Zeng, Lunjie, +9 more
core
Improved Comprehensive Performance of GaN-Based E-Mode HEMTs with a Thin Al<sub>2</sub>O<sub>3</sub> Interlayer. [PDF]
Qiao G +7 more
europepmc +1 more source
Enhanced Breakdown Voltage in GaN HEMTs Using Step-Graded AlGaN Buffer Layers. [PDF]
Bai J +5 more
europepmc +1 more source

