Results 91 to 100 of about 575,300 (214)
A Novel Concept of Electron-Hole Enhancement for Superjunction Reverse-Conducting Insulated Gate Bipolar Transistor with Electron-Blocking Layer. [PDF]
Wang Z, Yang C, Huang X.
europepmc +1 more source
Monolithic UV‐ozone oxidation of Ta forms an ultrathin Ta2O5/TaOx bilayer enabling resistive switching with a vertical defect gradient. A stoichiometric surface layer over an oxygen‐deficient sublayer promotes localized filament nucleation near the top interface, enabling low‐voltage operation, and reduced cycle‐to‐cycle variability.
Seunghoon Yang +11 more
wiley +1 more source
The insulated-gate bipolar transistor (IGBT) is the most advanced and promising power switching device. This paper presents an analytical model for the steady-state and transient characteristics of such a device.
I. Batarseh +5 more
core +2 more sources
The application of hybrid semiconductor switches (HyS) emerges as a solution to the increasing demand for higher switching frequency and power density at a competitive cost.
Pedro H. G. Vilela +4 more
doaj +1 more source
Prediction of Static Characteristic Parameters of an Insulated Gate Bipolar Transistor Using Artificial Neural Network. [PDF]
Yao Q +9 more
europepmc +1 more source
A conformal ALD‐IGZO vertical RRAM integrates volatile and nonvolatile switching within a compact 2F architecture. Before forming, tunable volatile dynamics provide fading‐memory reservoir states, while after forming, stable multilevel conductance modulation enables hardware readout.
Seeun Lee +6 more
wiley +1 more source
Design, Simulation and Fabrication of Insulated Gate Bipolar Transistors (IGBT) [PDF]
This project serves as a study to determine the feasibility of the current CMOS toolsets and processes available at Semiconductor \u26 Microsystems Fabrication Laboratory (SMFL) for the fabrication of whole wafer power devices.
Jhaveri, Tejas K
core
Thermomechanical Reliability Investigation of Insulated Gate Bipolar Transistor Module
Though, significant efforts have led to high solder joint quality, thermomechanical fatigue and delamination of the solder joints are still considered as one main failure cause in Insulated Gate Bipolar Transistor (IGBT) power modules.
Khatibi, Golta +7 more
core +1 more source
High-performance insulated gate bipolar transistors for soft-switching power converters.
High-performance insulated gate bipolar transistors for soft-switching power ...
Malay. Trivedi (7961123)
core +4 more sources
Because of developments in high-power converters, it has become crucial to investigate how effective inverter performance is. consequently, via being aware of the temperature value of the junction for the inverter switch.
Ahmed Shihab Ahmed, Riyadh Ghanim Omar
doaj +1 more source

