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Fast Thermal Resistance Distribution Analysis in High-Power VCSEL Array Module. [PDF]

Materials (Basel)
Li D, Lan T, Wang Z, Ye Z.
europepmc   +1 more source

Visualizing the Odd-Parity Superconducting Order Parameter and Its Quasiparticle Surface Band in UTe₂. [PDF]

J Low Temp Phys
Wang S, Davis JCS.
europepmc   +1 more source

Influence of Electrical Transients and A/D Converter Dynamics on Thermal Resistance Measurements of Power MOSFETs. [PDF]

Sensors (Basel)
Górecki K, Posobkiewicz K.
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Theoretical investigation and practical validation of AI based fault detection in BJT amplifier circuits. [PDF]

Sci Rep
Selim KK, Alaa A, Hassan O, Abdellatif SO.   +3 more
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Numerical study of flow and heat transfer in circular T-shaped junction of different cross-sections. [PDF]

PLoS One
Muhammad E, Shahid H, Qureshi SM, Babar Ramzan M.   +3 more
europepmc   +1 more source

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High temperature CoSb3–Cu junctions

Microelectronics Reliability, 2011
Abstract The subject of this work is to develop contact joints between a CoSb3 thermoelectric material and a copper electrode. The CoSb3–Cu junctions were produced by the resistance brazing (RB) technique in the atmosphere of protective gases (90% Ar + 10% H2), with the application of Ag–Cu metal fillers.
Krzysztof Tomasz Wojciechowski, Rafal Zybala, Ryszard Mania   +2 more
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