Results 271 to 280 of about 3,124 (304)
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Research of optical flats in pad polishing
SPIE Proceedings, 2009The influence of polishing an optical workpiece with a polyurethane pad is examined in this paper, including material removal rate, surface roughness and surface form error. Usually, optical polishing pitch is applied to polish optical workpieces, but the material removal rate (MRR) of pitch is quite low, and polyurethane foam is thus substituted for
Jian Wang +4 more
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Polishing Optical Parts with a Diamond Pad
Optical Fabrication and Testing Workshop, 1985We did experiments recently to try to develop a method of polishing optical parts with a diamond pad.
Xin Qiming, Robert E. Parks
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2004
Although polishing is an old technology [1, 2, 3], it has become an enabling process for the manufacture of leading-edge semiconductor devices. In the manufacture of such devices, polishing is used to maintain planarity at each step in the process of depositing and photolithographically imaging sequential insulating dielectric and conductive metal ...
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Although polishing is an old technology [1, 2, 3], it has become an enabling process for the manufacture of leading-edge semiconductor devices. In the manufacture of such devices, polishing is used to maintain planarity at each step in the process of depositing and photolithographically imaging sequential insulating dielectric and conductive metal ...
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Pad Polishing for Rapid Fabrication of Flats
Optical Fabrication and Testing, 1990Flat or mildly curved mirrors are required in very large quantity for the Inertial Confinement Fusion (ICF) Program, an active program at Los Alamos National Laboratory. The ultimate system will require in excess of 1,000 square meters of mirror surface.
Ralph R. Berggren +2 more
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Pad conditioning in chemical mechanical polishing
Journal of Materials Processing Technology, 2002Abstract As circuits become increasingly complex and device sizes shrink, the demands placed on manufacturing processes increases. For successful manufacture of such circuits, high levels of wafer planarity are required. Chemical mechanical polishing (CMP) is a manufacturing process used to achieve global planarity. Studies have shown that the degree
B.J Hooper, G Byrne, S Galligan
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Convergent Pad Polishing of Amorphous Silica
International Journal of Applied Glass Science, 2012A new method of optical polishing termed “ C onvergent P olishing” is demonstrated where a workpiece, regardless of its initial surface figure, will converge to the lap shape in a single iteration. This method of polishing is accomplished by identifying
Tayyab Suratwala +4 more
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Proposal of New Polishing Technology without Using a Polishing Pad
CIRP Annals, 2002Abstract A polishing method that uses no polishing pad is proposed, in which fine polymer particles are supplied together with abrasives onto a hard tool plate. The polymer particles prevent direct contact between workpiece and tool plate and serve as countless micro pads rubbing the abrasives against the workpiece for polishing action, so that not ...
Y. Lu, Y. Tani, K. Kawata
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Impact of Polish Pad Imperfections on Chemical Mechanical Polishing Defects
Journal of The Electrochemical Society, 2006The wafer level impact of different IC1000 pad imperfections were screened and evaluated. The defect classifications were based on visual inspection and segregation of pads used during a 3 month period under a high-volume manufacturing environment. The screening tests revealed that the defects must be embedded into or onto the pad to cause a negative ...
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S1330203 Polishing characteristics of porous polishing pads
The Proceedings of Mechanical Engineering Congress, Japan, 2014Yasuhiro TANI +3 more
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