Results 31 to 40 of about 14,138 (303)
Plasma-etch-free β-Ga2O3–NiO–PtOx merged PiN Schottky diode with high-voltage stress reliability [PDF]
A gallium oxide (Ga2O3)–nickel oxide (NiO) merged PiN Schottky (MPS) diode was fabricated using Ga flux plasma-free etch and platinum oxide (PtOx) contacts.
Marko J. Tadjer +13 more
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Schottky barrier heights and electronic transport in Ga2O3 Schottky diodes
The Schottky contact, formed at the interface between a metal and a semiconductor, is instrumental in defining the electrical properties of Schottky barrier diodes (SBDs).
Min-Yeong Kim +5 more
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Despite the intensive study on the promotion of device performance, the device physics regarding the effects of Schottky barrier on the charge injection in conjugated polymer transistors still need more discussions.
Yang Xu, Fanming Huang, Wenwu Li
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We have studied the dependence of Schottky junction (I–V) characteristics on the metal contact size in metal–semiconductor (M–S) junctions using different metal nanoprobe sizes. The results show strong dependence of (I–V) characteristics on the nanoprobe
Moh’d Rezeq +5 more
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Formation CMOS Schemes on GaAs with Self-Aligned Nitride and Silicide Gates
Advanced integrated logic circuits on GaAs are mainly based on the using of n-channel field-effect transistors with gate Schottky (MESFET). To create the complementary MESFET integrated circuits the main problem is quite small Schottky barrier height ...
S. P. Novosjadly +2 more
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n-type binary compound semiconductors such as InN, InAs, or In2O3 are especial because the branch-point energy or charge neutrality level lies within the conduction band. Their tendency to form a surface electron accumulation layer prevents the formation of rectifying Schottky contacts.
von Wenckstern, Holger +5 more
openaire +3 more sources
In-nSiC schottky photodiode ; Fabrication and Study [PDF]
In the present work , schottky photodiode have been mode on n-type SiCby depositing of thin layer of In . electrical characteristics included I-V(dark and illumination ) have been investigated .
Khalid Z. Yahiya +2 more
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Graphenic Carbon: A Novel Material to Improve the Reliability of Metal-Silicon Contacts
Contact resistance and thermal degradation of metal-silicon contacts are major challenges in nanoscale CMOS as well as in power device applications. Titanium silicide (TiSi) is commonly used to establish low-barrier height contacts to silicon, in state ...
Max Stelzer, Moritz Jung, Franz Kreupl
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Wet chemical treatment is a conventional surface cleaning method, and metal oxide photocatalysts are commonly used to decompose organic compounds in water.
Koji Abe
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