Results 91 to 100 of about 13,076 (221)

High‐Performance Ultra‐Wide‐Bandgap CaSnO3 Metal‐Oxide‐Semiconductor Field‐Effect Transistors

open access: yesAdvanced Electronic Materials, Volume 11, Issue 19, November 18, 2025.
High‐performance enhancement‐mode MOSFET devices made from ultra‐wide bandgap semiconductor CaSnO3 are demonstrated for the first time with an on/off ratio exceeding 108, field‐effect mobility of 8.4 cm2 V−1 s−1, low contact resistance of 0.73 kΩ·µm, and a record breakdown field of ∼8.3 MV cm−1.
Weideng Sun   +10 more
wiley   +1 more source

Modular integrated SiC MOSFET matrix converter [PDF]

open access: yes, 2017
This paper presents the assembly and characterization of an integrated all SiC 3-to-1 phases matrix converter, of typical application in domains requiring harsh environment withstand capability with high reliability and availability levels (e.g ...
Aliyu, Attahir Murtala   +3 more
core   +1 more source

Enhancing Electrical and Interfacial Properties of BeO/4H‐SiC Structures with SiO2 Interlayer

open access: yesAdvanced Electronic Materials, Volume 11, Issue 19, November 18, 2025.
The integration of a SiO2 interlayer into the BeO/4H‐SiC stack effectively suppresses carbon‐induced interfacial defects during post‐deposition annealing. This achieves significantly lower interface trap densities and enhanced dielectric strength. Electrical measurements and band‐offset analysis confirm improved carrier confinement, demonstrating the ...
Sangoh Han   +7 more
wiley   +1 more source

Research on Single-Switch Wireless Power Transfer System Based on SiC MOSFET

open access: yesIEEE Access, 2019
The traditional wireless power transfer circuit uses the full-bridge or half-bridge inverter, which has complex circuit and control and low reliability.
Houji Li   +3 more
doaj   +1 more source

Spin resonance of 2D electrons in a large-area silicon MOSFET

open access: yes, 2007
We report electron spin resonance (ESR) measurements on a large-area silicon MOSFET. An ESR signal at g-factor 1.9999(1), and with a linewidth of 0.6 G, is observed and found to arise from two-dimensional (2D) electrons at the Si/SiO2 interface.
A.M. Tyryshkin   +16 more
core   +1 more source

Silicon carbide semiconductor technology for high temperature and radiation environments [PDF]

open access: yes
Viewgraphs on silicon carbide semiconductor technology and its potential for enabling electronic devices to function in high temperature and high radiation environments are presented.
Matus, Lawrence G.
core   +1 more source

High-temperature characteristics of SiC module and 100 kW SiC AC-DC converter at a junction temperature of 180 °C

open access: yesGlobal Energy Interconnection, 2019
High-temperature, high-power converters have gained importance in industrial applications given their ability to operate in adverse environments, such as in petroleum exploration, multi-electric aircrafts, and electric vehicles.
Juanjuan Lu   +5 more
doaj   +1 more source

MOSFET parallel-connection of low-voltage MMC for LVDC distribution networks [PDF]

open access: yes, 2016
A highly efficient DC-AC converter is key to the success of low-voltage DC (LVDC) distribution networks. Calculated power losses in a conventional IGBT 2-level converter, a SiC MOSFET 2-level converter, a Si MOSFET modular multilevel converter (MMC) and ...
Finney, Stephen   +3 more
core  

Early fault detection in SiC-MOSFET with application in boost converter

open access: yesRevista Facultad de Ingeniería Universidad de Antioquia, 2018
This paper presents the design of a fault detection circuit applied to a silicon carbide Mosfet (SiC-Mosfet). Fault detection is done by monitoring the behavior of the gate signal. The most important characteristic that has been reported in literature is
Leobardo Hernández-González   +6 more
doaj  

Research on High Efficient Resonant Full-bridge Converter with High Voltage SiC MOSFET

open access: yesKongzhi Yu Xinxi Jishu, 2016
With SiC MOSFET, resonant converter can achieve high frequency and high efficiency, thus increasing the power density with reducing total cost and simplify topology.
Jimmy Liu, John Mookken, Kin Lap
doaj  

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