Results 41 to 50 of about 1,030 (185)
The paper reviews the development of the 3C-SiC MOSFETs in a unique development project combining the material and device expertise of HAST (Hoya Advanced Semiconductor Technologies) and Acreo, respectively. The motivation for the development of the 3C-SiC MOSFETs and the summary of the results from the lateral and vertical devices with varying size ...
Mietek Bakowski +5 more
openaire +2 more sources
A chronically implantable neural interface enables real‐time multimodal monitoring of electrical, thermal, and photodynamic activities. Incorporating silicon‐based transistor arrays with a functional multiplexing strategy and resistive sensors, the device delivers high‐fidelity recordings with long‐term stability and biocompatibility.
Jiahao Li +18 more
wiley +1 more source
Bulk Rutile‐GeO2 Single Crystals and Epi‐Ready Wafers
Undoped and Sb‐doped bulk rutile‐GeO2 single crystals up to 18 mm in diameter are grown by the Top Seeded Solution Growth. Inclusion‐free and transparent crystals enable to preparation of epi‐ready wafers with different orientations and sizes up to 10 mm.
Zbigniew Galazka +9 more
wiley +1 more source
We propose a novel five‐level active‐neutral‐point‐clamped converter utilising reverse blocking IGBT (RB‐IGBT). The inverter configuration significantly reduces conduction losses, as only two switches are on the current paths in some switching states. We also propose an optimised state machine‐based modulation strategy.
Mingxia Xu +4 more
wiley +1 more source
An Improved SiC MOSFET With Integrated Schottky Contact Super Barrier Rectifier
This study focuses on the SiC MOSFET with integrated Schottky contact super barrier rectifier (SiC SSBR-MOSFET) through the application of TCAD simulation methodologies.
Xintian Zhou +7 more
doaj +1 more source
In this paper, the crosstalk-induced shoot-through current and induced gate voltage of SiC planar MOSFETs, SiC symmetrical double-trench MOSFETs and SiC asymmetrical double-trench MOSFETs is investigated on a half-bridge circuit to analyse the impact of ...
Juefei Yang +6 more
doaj +1 more source
Approximate SPICE Modeling of SiC MOSFETs
The recent adaptation of wide bandgap (WBG) semiconductors pushes the SPICE circuit simulation software to the very edge, requiring computationally light and accurate assessment of rapid and oscillatory transients. One of the main limitations in SPICE modeling of WBG semiconductors is the lack of built-in models in the available software, forcing usage
Pawel Piotr Kubulus +5 more
openaire +3 more sources
This paper adopts a Neutral‐Point‐Clamped H‐bridge (NPC‐H) DAB topology to mitigate voltage stress on the input‐side switches. For both charging and discharging scenarios, a direct current control method is proposed using the output current as the primary control variable.
Yunxiang Jiang +3 more
wiley +1 more source
Research on High-power Full SiC Converter
In order to adapt to the development trend of high frequency and high power density of converter products, the application of high-power all-SiC-MOSFET device in converter was studied.
ZHANG Qing +5 more
doaj
In this paper, two types of Silicon (Si) IGBT and Silicon Carbide (SiC) hybrid switch (Si/SiC HyS) based three-level active neutral-point-clamped (3L-ANPC) inverter are proposed for high efficiency and low device cost.
Haichen Liu, Tiefu Zhao, Xuezhi Wu
doaj +1 more source

