Results 111 to 120 of about 103,452 (148)

Microstructures etched in doped TMAH solutions

Microelectronic Engineering, 2000
Tetra-methyl ammonium hydroxide, or TMAH, is an anisotropic silicon etchant that is gaining more and more attention in the fabrication process of mechanical microstructures and device isolation, as an alternative to the more usual KOH and EDP etchants [1]: because of its high compatibility with conventional IC processes, due to the absence of metal ...
S. Brida, M. Paranjape, G. Pignatel, Faes, Alessandro, Guarnieri, Vittorio, Giacomozzi, Flavio, Margesin, Benno, Zen, Mario   +7 more
openaire   +2 more sources

Smooth etching of silicon using TMAH and isopropyl alcohol for MEMS applications

Microelectronic Engineering, 2005
Etching of silicon plays an important role in the field of micromachining. In this study, etching was performed on (1 0 0), (1 1 0) and (1 1 1) silicon using tetramethylammonium hydroxide (TMAH). The roughness of the etched silicon surface was studied as
Ganesh Subramanian, Kalpathy Sundaram
exaly   +3 more sources

Silicon etching characteristics for the TMAH based solution with additives

10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2015
In this study, the anisotropic etching properties of single crystal silicon were examined using the TMAH solution. The effect of IPA additive was also examined. As the THAM concentration (10~25 wt.%) decreased, the etching rate increased from 10 μm/h to 70 μm/h at temperatures between 70 and 90°C.
Ki-Wha Jun, Jung-Sik Kim
openaire   +2 more sources

Etched profile control in anisotropic etching of silicon by TMAH+Triton

Journal of Micromechanics and Microengineering, 2012
The adverse effect of mechanical agitation (magnetic bead stirring) as well as galvanic interaction between the evolving facets of the etch front on the amount of undercutting during anisotropic etching of Si{1 0 0} wafers in surfactant-added tetramethylammonium hydroxide (TMAH) is studied by etching different mask patterns in magnetically stirred and ...
Prem Pal, M A Gosálvez, K Sato
openaire   +2 more sources

Evolution of hillocks during silicon etching in TMAH

Journal of Micromechanics and Microengineering, 2000
The evolution of hillocks on (100)-silicon etched in 4 wt% tetramethyl ammonium hydroxide is studied through a detailed examination of hillock size distribution and individual hillock features using low-voltage scanning electron microscopy. Silicon samples etched for periods of 1.5, 3 and 5 min show that the population of hillocks initially comprises ...
Thong, J.T.L., Luo, P., Choi, W.K., Tan, S.C.   +3 more
openaire   +1 more source

A Si3N4 Tube Formed Using TMAH Etching

First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 2007
In this paper, micro-tube fabricated from SiO2/Si3N4 strained composite structures using a self-scrolling procedure is presented. This fabrication is a self-organization process using stress of bifilm. This technique is based on self-rolling of a thin highly strained SiO2/ Si3N4 bifilm detached from the substrate by TMAH selective etching. The material
Huijun Chen, Dacheng Zhang
openaire   +1 more source

Formation of pyramids at surface of TMAH etched silicon

Applied Surface Science, 1999
An investigation on the influence of etchant concentration and ambient temperature on the formation of pyramids arising from the TMAH etching of silicon has been carried out. The number and size of the pyramids were used as parameters for the investigation.
Choi, W.K., Thong, J.T.L., Luo, P., Bai, Y., Tan, C.M., Chua, T.H.   +5 more
openaire   +1 more source

An Experimental Study of TMAH Etching Silicon for MEMS

First International Conference on Integration and Commercialization of Micro and Nanosystems, Parts A and B, 2007
In the process of Micro-Electrical-Mechanical System (MEMS), the anisotropic wet chemical etching rate of the silicon wafer is very important for fabricating MEMS to determine the fabricating method, processing and etching time. The etching rates of the silicon wafer in the TMAH solution with the different temperature are obtained in this paper.
Feiyan Chen, Guoqing Hu, Baihai Wu
openaire   +1 more source

Si and SiGe Alloys Wet Etching Using TMAH Chemistry

ECS Transactions, 2013
From MEMS to CMOS applications, silicon wet anisotropic etching is nowadays considered as an interesting alternative to face new and various technological challenges. This paper focuses on the TMAH chemistry and its use for Si and Si1-xGex alloys etching.
Virginie Loup, Laurence Gabette, Marie-Christine Roure, Riadh Kachtouli, Marine Jourdan, Pascal Besson, Sebastien Petitdidier   +6 more
openaire   +1 more source

Fabrication of high aspect ratio AFM tips by surfactant added TMAH etching

Sensors and Actuators A: Physical
Farheen Nasir
exaly   +2 more sources