Results 131 to 140 of about 103,452 (148)

Electrochemical etch-stop in TMAH without externally applied bias

Sensors and Actuators A: Physical, 1996
Abstract This paper presents a method for electrochemical etch-stop without the use of an externally applied bias voltage. This greatly simplifies the etch process and enables batch fabrication to be achieved. The process is based on the formation of a wet battery when a gold-chrome/n-type silicon/TMAH construction is formed.
P.J. French, M. Nagao, M. Esashi
openaire   +1 more source

Surface roughness of single-crystal silicon etched by TMAH solution

Sensors and Actuators A: Physical, 2001
We investigated the surface roughness properties of single-crystal silicon etched by a TMAH water solution. We used a hemispherical specimen, in which all crystallographic orientation planes appeared on the surface, and made a map of the surface roughness distribution pattern.
Mitsuhiro Shikida, Takehiro Masuda, Daisuke Uchikawa, Kazuo Sato   +3 more
openaire   +1 more source

Non standard behaviour of TMAH anisotropic wet etching

2022
Trabajo presentado en Eurosensors XII: 12th European Conference on Solid-State Transducers and the 9th UK Conference on Sensors and Their Applications, celebrado en Southampton (Reino Unido), del 13 al 16 de septiembre de ...
Duch, M., Esteve i Tintó, Jaume, Acero Leal, María Cruz, Merlos Domingo, Ángel   +3 more
openaire   +1 more source

Optimization of (100)-Si TMAH etching for uncooled infrared detector

SPIE Proceedings, 2009
The influences of concentration of the Tetra-methyl ammonium hydroxide (TMAH) solution together with oxidizer additions were studied in order to optimize the anisotropic silicon etching in the development of a fabrication process for Ba 0.65 Sr 0.35 TiO 3 (BST) pyroelectric thin film infrared detectors.
Y. Shuai, C. G. Wu, W. L. Zhang, Y. R. Li, X. Z. Liu, J. Zhu   +5 more
openaire   +1 more source

The Use of TMAH to Etch Silicon and Expose Metal Bridging Failures

International Symposium for Testing and Failure Analysis, 2000
Abstract Determination of metal bridging failures on plastic encapsulated devices is difficult due to the metal etching effects that occur while removing many of the plastic mold compounds. Typically, the acids used to remove the encapsulation are corrosive to the metals that are found within the device. Thus, decapsulation can result in
Mark Morris, James Mohr, Esteban Ortiz, Steven Englebretson   +3 more
openaire   +1 more source

The fabrication of silicon nanostructures by focused-ion-beam implantation and TMAH wet etching

Nanotechnology, 2010
Local gallium implantation of silicon by a focused ion beam (FIB) has been used to create a mask for anisotropic tetramethylammonium hydroxide (TMAH) wet etching. The dependence of the etch stop properties of gallium-doped silicon on the implanted dose has been investigated and a dose of 4 x 10(13) ions cm(- 2) has been determined to be the threshold ...
Tittonen Ilkka, Chekurov Nikolai, Sievilä Päivi   +2 more
openaire   +2 more sources

Study of Si(1 0 0) surfaces etched in TMAH solution

Sensors and Actuators A: Physical, 2001
Abstract Si(1 0 0) surfaces treated in a tetramethylammonium hydroxide (TMAH) solution at 70°C have been studied using spectroscopic ellipsometry (SE) and ex situ atomic force microscopy (AFM). The SE data indicate that surface native oxide is etched gradually and then lift-off in places with immersing in the solution. Since the solution attacks bulk
Kaoru Sakaino, Sadao Adachi
openaire   +1 more source

Anisotropic etching rates of single-crystal silicon for TMAH water solution as a function of crystallographic orientation

Sensors and Actuators A: Physical, 1999
Mitsuhiro Shikida
exaly  

Differences in etching characteristics of TMAH and KOH on preparing inverted pyramids for silicon solar cells

Applied Surface Science, 2013
Yupeng Xing, Shaoxu Hu, Peide Han
exaly  

TMAH-Based Anisotropic Etching

2017
openaire   +1 more source