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Current Status of NAND Memories and its Future Prospect with 3D NAND Technology
ECS Meeting Abstracts, 2012Abstract not Available.
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Reliability challenges in 3D NAND Flash memories
2019 IEEE 11th International Memory Workshop (IMW), 2019The reliability of 3D NAND Flash memory technology is depending on many factors. Most of them are related to the process-induced variability of the layers. Endurance, data retention capabilities, and cross-temperature immunity are the metrics that become affected by this, turning in peculiar reliability challenges that are difficult to be tackled ...
Zambelli C., Micheloni R., Olivo P.
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Etching of Silicon Nitride in 3D NAND Structures
ECS Meeting Abstracts, 20153D NAND structures present a unique difficulty in semiconductor device manufacturing. One method of production consists of cylindrical structures made of alternating layers of silicon dioxide (SiO2) and silicon nitride (SiN) with a core of SiO2. As part of the device manufacturing process the SiN is etched away, leaving the SiO2 core with disc-shaped
Derek Bassett +2 more
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3D NAND Scaling in the next decade
2022 International Electron Devices Meeting (IEDM), 2022Russ Meyer +2 more
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Etch Challenges for 3D NAND Flash Technology
ECS Meeting Abstracts, 2014Current 2D NAND scaling is approaching technology limitation in both lithography and device performance arena. To address the lithography challenges at the 1x nodes and the well-known scaling issues associated with planar NAND, 3D flash technology is being developed and is expected to greatly reduce the lithography burden albeit shifting it to ...
Anisul Haque Khan +4 more
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3D Floating Gate NAND Flash Memories
2016Planar NAND Flash memories (commercially available) are based on Floating Gate, which has been developed and engineered for many decades. Therefore, there have been many attempts to develop 3D Floating Gate cells in order to re-use all the know-how cumulated over time.
Rino Micheloni, Luca Crippa
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3D-NAND Flash and Its Manufacturing Process
2016Flash memory chips are nonvolatile memory (NVM) chips, which can keep memory without power supply. In comparison, DRAM is volatile memory and needs a power supply. Flash memory chips, especially NAND flash memory chips, are commonly used in universal serial bus (USB) drives, secure digital (SD) cards, and SSDs.
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3D VG-Type NAND Flash Memories
2016The common feature among the different 3D NAND solutions is constituted by very deep vertical (z direction) etching steps that define the Flash cells geometries simultaneously. Transistor geometries are formed by the deep trench through a multiple polysilicon/oxide stack.
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