Results 11 to 20 of about 209 (132)

3D NAND Flash Memory Cell Current and Interference Characteristics Improvement With Multiple Dielectric Spacer

open access: yesIEEE Access, 2023
To achieve high density, the spacer length of three dimensional (3D) NAND device has been scaled down. When the program/erase cycle repeats, problems such as electrons accumulation in the inter-cell region are occurred. To solve this problem, a method of
Yun-Jae Oh   +4 more
doaj   +1 more source

3D NAND Flash Memory Based on Double-Layer NC-Si Floating Gate with High Density of Multilevel Storage

open access: yesNanomaterials, 2022
As a strong candidate for computing in memory, 3D NAND flash memory has attracted great attention due to the high computing efficiency, which outperforms the conventional von-Neumann architecture. To ensure 3D NAND flash memory is truly integrated in the
Xinyue Yu   +6 more
doaj   +1 more source

Metrology Challenges in 3D NAND Flash Technical Development and Manufacturing

open access: yesJournal of Microelectronic Manufacturing, 2020
3D NAND technical development and manufacturing face many challenges to scale down their devices, and metrology stands out as much more difficult at each turn. Unlike planar NAND, 3D NAND has a three-dimensional vertical structure with high-aspect ratio.
Wei Zhang   +4 more
doaj   +1 more source

Impact of Stacking-Up and Scaling-Down Bit Cells in 3D NAND on Their Threshold Voltages

open access: yesMicromachines, 2022
Over the past few decades, NAND flash memory has advanced with exponentially-increasing bit growth. As bit cells in 3D NAND flash memory are stacked up and scaled down together, some potential challenges should be investigated.
Dongwoo Lee, Changhwan Shin
doaj   +1 more source

Hydrogen Source and Diffusion Path for Poly-Si Channel Passivation in Xtacking 3D NAND Flash Memory

open access: yesIEEE Journal of the Electron Devices Society, 2020
Poly-Si channels need well passivated by using hydrogen passivation process in 3D NAND flash memories for better poly-Si quality with low trap density.
Xinshuai Shen   +7 more
doaj   +1 more source

Self-Adaption of the GIDL Erase Promotes Stacking More Layers in 3D NAND Flash

open access: yesMicromachines, 2023
The bit density is generally increased by stacking more layers in 3D NAND Flash. Gate-induced drain leakage (GIDL) erase is a critical enabler in the future development of 3D NAND Flash.
Tao Yang   +4 more
doaj   +1 more source

Impact of Cycling Induced Intercell Trapped Charge on Retention Charge Loss in 3-D NAND Flash Memory

open access: yesIEEE Journal of the Electron Devices Society, 2020
As the 3D NAND technology developing toward more and more stack layers, it is essential to shrink the gate length (Lg) and inter-gate space (Ls). However, one of key concerns of scaling Lg/Ls 3D NAND flash is post-cycling data retention characteristics ...
Xinlei Jia   +11 more
doaj   +1 more source

A Novel Program Suspend Scheme for Improving the Reliability of 3D NAND Flash Memory

open access: yesIEEE Journal of the Electron Devices Society, 2022
Experimental results indicate that the conventional program suspend scheme in 3D NAND flash memory chip can generate unexpected additional read fail bits and reduce the reliability of 3D NAND flash memory. These extra read fail bits are observed when the
Zhichao Du   +11 more
doaj   +1 more source

Forensic Analysis of the Nintendo 3DS NAND

open access: yesDigital Investigation, 2019
Abstract Games consoles present a particular challenge to the forensics investigator due to the nature of the hardware and the inaccessibility of the file system. Many protection measures are put in place to make it deliberately difficult to access raw data in order to protect intellectual property, enhance digital rights management of software and ...
Gus Pessolano   +3 more
openaire   +2 more sources

Channel Modeling and Quantization Design for 3D NAND Flash Memory

open access: yesEntropy, 2023
As the technology scales down, two-dimensional (2D) NAND flash memory has reached its bottleneck. Three-dimensional (3D) NAND flash memory was proposed to further increase the storage capacity by vertically stacking multiple layers.
Cheng Wang   +5 more
doaj   +1 more source

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