Results 31 to 40 of about 4,456 (178)
Power Reduction in Punch-Through Current-Based Electro-Thermal Annealing in Gate-All-Around FETs
Device guidelines for reducing power with punch-through current annealing in gate-all-around (GAA) FETs were investigated based on three-dimensional (3D) simulations.
Jun-Young Park +2 more
core +1 more source
A Low‐Power Cryogenic Low‐Noise Amplifier for the Next‐Generation Quantum Computers
Next generation of quantum computers calls for reduced dc power dissipation of the cryogenic low‐noise amplifier (LNA) applied in reading out the superconducting qubits. This article reports on processing and evaluation of a 100‐nm gate length indium phosphide high electron mobility transistor (InP HEMT) technology used in the design of such LNAs.
Nelson Rebelo +4 more
wiley +1 more source
Performance analysis of undoped cylindrical gate all around (GAA) MOSFET at subthreshold regime
In this work the sensitivity of process parameters like channel length (L), channel thickness (tSi), and gate work function (M) on various performance metrics of an undoped cylindrical gate all around (GAA) metal-oxide-semiconductor field effect transistor (MOSFET) are systematically analyzed.
B Jena +5 more
openaire +1 more source
Ion screening in CF4 plasma reduces CFx+ ion flux while maintaining radical fluxes, suppressing fluorocarbon polymer accumulation. This enables smooth SiGe etching with selectivity up to 30:1 in multilayer stacks. ABSTRACT Selective etching of Si0.7Ge0.3 was investigated in CF4 inductively coupled plasma using an ion‐screening approach to decouple ion ...
Joosung Kang +6 more
wiley +1 more source
Gate electrostatic controllability enhancement in nanotube gate all around field effect transistor
Recently, short channel effects (SCE) and power consumption dissipation problems impose tremendous challenges that need imperative actions to be taken to deal with for field effect transistor to further scale down as semiconductor technology enters into ...
Chunlai Li +9 more
core +1 more source
Atomic Layer Deposition in Transistors and Monolithic 3D Integration
Transistors are fundamental building blocks of modern electronics. This review summarizes recent progress in atomic layer deposition (ALD) for the synthesis of two‐dimensional (2D) metal oxides and transition‐metal dichalcogenides (TMDCs), with particular emphasis on their enabling role in monolithic three‐dimensional (M3D) integration for next ...
Yue Liu +5 more
wiley +1 more source
Edge effects characterization in gate-all-around SOI MOSFETs
The well-known edge effect due to conduction in the parasitic edge transistor at low gate voltages takes place when the threshold voltage is lowered at the device edges.
Flandre, Denis +4 more
core +1 more source
Lipid drug carriers to which ultra‐small gold nanoparticles were added enabled more efficient radiotherapy of cultured pancreatic cancer tumors. These nanoparticles boosted radiation‐induced damage to tumors by generating more reactive molecules, though higher gold levels are needed for strong benefits.
Nazareth Milagros Carigga Gutierrez +17 more
wiley +1 more source
High‐Yield Fabrication of Electrolyte‐Gated Transistors Based on Graphene Acetic Acid
We fabricated a liquid‐gated transistor based on graphene acetic acid, which is dielectrophoretically deposited, featuring a spatial resolution down to 10 microns. Our method enables a versatile and reproducible fabrication featuring state‐of‐the‐art performance.
Georgian Giani Ilie +13 more
wiley +1 more source
Tunability of Parasitic Channel in Gate-All-Around Stacked Nanosheets
International audienceFor the first time, a comprehensive study going from the integration of 3D stacked nanosheets Gate-All-Around (GAA) MOSFET devices to SPICE modeling is proposed.
G. Audoit +41 more
core +1 more source

