Results 31 to 40 of about 3,650 (215)
The Role of Frequency and Duty Cycle on the Gate Reliability of p-GaN HEMTs
In this letter, we present an extensive analysis on the role of both switching frequency (ranging from 100 kHz to 1 MHz) and duty cycle (from 10% to 90%) on the time-dependent gate breakdown of high electron mobility transistors (HEMTs) with Schottky metal to p-GaN gate.
M. Millesimo +7 more
openaire +2 more sources
High-Temperature Time-Dependent Gate Breakdown of p-GaN HEMTs
In this article, we present an in-depth high-temperature analysis of the long-term gate reliability in GaN-based power high-electron-mobility transistors (HEMTs) with p-type gate. Three different isolation process options, aimed at improving the time-dependent gate breakdown (TDGB), are proposed and compared by means of constant voltage stress tests ...
M. Millesimo +6 more
openaire +2 more sources
GAN‐LSTM‐3D: An efficient method for lung tumour 3D reconstruction enhanced by attention‐based LSTM
Abstract Three‐dimensional (3D) image reconstruction of tumours can visualise their structures with precision and high resolution. In this article, GAN‐LSTM‐3D method is proposed for 3D reconstruction of lung cancer tumours from 2D CT images. Our method consists of three phases: lung segmentation, tumour segmentation, and tumour 3D reconstruction. Lung
Lu Hong +12 more
wiley +1 more source
In this paper, a T-shaped gate with a dual dielectric layer is proposed for enhancement-mode p-GaN/AlGaN/GaN heterojunction field-effect transistors (HFETs), designed to reduce gate leakage current and improve gate forward breakdown voltage. The proposed
Min-Gi Jeong +2 more
doaj +1 more source
A review on the GaN-on-Si power electronic devices
The past decades have witnessed a tremendous development of GaN-based power electronic devices grown on Si substrate. This article provides a concise introduction, review, and outlook of the research developments of GaN-on-Si power device technology. The
Yaozong Zhong +7 more
doaj +1 more source
Developing of normally-off p-GaN gate HEMT
Abstract In this paper, the high electron mobility transistor (HEMT) with p-GaN gate is developed. The article demonstrates development of normally-off p-GaN gate HEMT on heterostructure with AlN stop layer for p-GaN selective etching and formation of normally-on GaN HEMT on the same wafer.
O B Kukhtyaeva +7 more
openaire +1 more source
Gate-Bias Induced RON Instability in p-GaN Power HEMTs
In this letter, we investigate the on-resistance ( RON ) instability in p-GaN power HEMTs induced by a positive or negative gate bias ( VGB ), following the application of a quasi-static initialization voltage ( VGP ) of opposite sign. The transient behavior of this instability was characterized at different temperatures in the 90–135 °C range.
Chini, Alessandro +7 more
openaire +2 more sources
Structural Optimization of p-GaN Gate GaN-Based High Electron Mobility Transistors
In order to simplify the complexity of circuit design and reduce the cost, normally-off high electron mobility transistors are more preferable in the industry. The device with p-GaN gate has drawn increasing attention in the industry. In order to improve
GE Mei; LI Yi; WANG Zhiliang; ZHU Youhua
doaj +1 more source
P-GaN Gate HEMTs: A Solution to Improve the High-Temperature Gate Lifetime
In this letter, we report an approach to improve the forward bias gate reliability of Schottky gate p-GaN HEMTs. In particular, a gate layout solution, namely Gate Within Active Area (GWA), aimed at improving the high-temperature time to failure (TTF), is proposed and validated. This solution allows to avoid the exposure of the gate finger (p-GaN/metal)
A. N. Tallarico +8 more
openaire +2 more sources
High Power Added Efficiency Enhancement-Mode Γ-Gate RF HEMT With High/Low p-GaN Doping Profile
$0.5~\mu $ m enhancement-mode (E-mode) p-GaN $\Gamma $ -gate RF HEMT with engineered Mg doping profile in p-GaN layer was studied for high power amplifier application.
Hsien-Chin Chiu +6 more
doaj +1 more source

