Results 11 to 20 of about 22,855 (262)

Wet Chemical and Plasma Etching of Photosensitive Glass

open access: yesSolids, 2023
Photosensitive glasses for radiation-induced 3D microstructuring, due to their optical transparency and thermal, mechanical, and chemical resistance, enable the use of new strategies for numerous microscale applications, ranging from optics to biomedical
Ulrike Brokmann   +4 more
doaj   +2 more sources

Formation of Functional Silicon Nitride Layers by Selective Plasmochemical Etching

open access: yesДоклады Белорусского государственного университета информатики и радиоэлектроники, 2022
At present, with the development of nanotechnology, plasma-chemical etching remains practically the only tool for transferring an integrated circuit pattern in a masking layer to a substrate material due to the fact that the pattern transfer accuracy is ...
V. V. Emelyanov
doaj   +1 more source

Advances in precision freeform manufacturing by plasma jet machining -INVITED [PDF]

open access: yesEPJ Web of Conferences, 2020
Atmospheric pressure plasma jet machining technology provides a flexible and efficient way to fabricate precise freeform optics. Due to the pure chemical material removal mechanism based on a dry etching process using fluorine containing gas, the choice ...
Arnold Thomas   +2 more
doaj   +1 more source

Anisotropic plasma-chemical etching by an electron-beam-generated plasma [PDF]

open access: yesJournal of Applied Physics, 1988
Anisotropic etching of SiO2 has been achieved with a plasma generated by a broad-area low-energy (150–300 eV) electron beam in a He+CF4 atmosphere. Etch rates of up to 330 Å/min for SiO2 and 220 Å/min for Si were obtained. Etching occurred with good uniformity over the entire area exposed to the electron-beam-generated plasma.
T. R. Verhey, J. J. Rocca, P. K. Boyer
openaire   +3 more sources

Influence of vacuum-plasma treatment modes on the surface photo-EMF of single-crystal silicon

open access: yesФизико-химические аспекты изучения кластеров, наноструктур и наноматериалов, 2022
Plasma technologies in the last quarter of the twentieth century made a real scientific and technological revolution in microelectronics. Having come to the world of microelectronics technology as a necessary alternative to liquid etching, which had ...
R.R. Nagaplezheva   +4 more
doaj   +1 more source

Study of Atmospheric Pressure Plasma Temperature Based on Silicon Carbide Etching

open access: yesMicromachines, 2023
In order to further understand the excitation process of inductively coupled plasma (ICP) and improve the etching efficiency of silicon carbide (SiC), the effect of temperature and atmospheric pressure on plasma etching of silicon carbide was ...
Shaozhen Xu   +4 more
doaj   +1 more source

Plasma chemical silicon etching process*

open access: yesIOP Conference Series: Materials Science and Engineering, 2016
The cryogenic plasma chemical silicon etching process is developed, able to form the structured silicon layer with system of deep holes with high aspect ratio.
K V Rudenko   +5 more
openaire   +1 more source

Advanced Etching Techniques of LiNbO3 Nanodevices

open access: yesNanomaterials, 2023
Single LiNbO3 (LNO) crystals are widely utilized in surface acoustic wave devices, optoelectronic devices, and novel ferroelectric memory devices due to their remarkable electro-optic and piezoelectric properties, and high saturation and remnant ...
Bowen Shen   +7 more
doaj   +1 more source

Micro-texturing into DLC/diamond coated molds and dies via high density oxygen plasma etching

open access: yesManufacturing Review, 2015
Diamond-Like Carbon (DLC) and Chemical Vapor Deposition (CVD)-diamond films have been widely utilized not only as a hard protective coating for molds and dies but also as a functional substrate for bio-MEMS/NEMS.
Yunata Ersyzario Edo, Aizawa Tatsuhiko
doaj   +1 more source

RESEARCH PROCESS PLASMA ETCHING SIO2 MEMBRANE

open access: yesВестник Дагестанского государственного технического университета: Технические науки, 2016
The article discusses the results of plasma chemical etching of silicon dioxide in the fluorine-containing medium in the manufacture of semiconductor devices.
T. A. Ismailov   +3 more
doaj   +1 more source

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