Results 101 to 110 of about 354 (151)
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Decoupled tunneling and GIDL effects for 28nm high-k stacked nMOSFETs
2017 6th International Symposium on Next Generation Electronics (ISNE), 2017One interesting result for 28nm high-k stacked n-channel MOSFET with W/L= 0.5/0.12 (μm/μm) electrically sensed demonstrates the tunneling and GIDL effects which can effectively be decoupled by gate bias at accumulation mode. Due to the drain bias assisted, the decoupling performance in this work is more apparent.
Mu-Chun Wang, Shea-Jue Wang
exaly +2 more sources
Gate-Induced-Drain-Leakage (GIDL) in CMOS Enhanced by Mechanical Stress
IEEE Transactions on Electron Devices, 2022Anastasiia Kruv +2 more
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Investigation of the characteristics of GIDL current in 90nm CMOS technology
Chinese Physics, 2006A specially designed experiment is performed for investigating gate-induced drain leakage (GIDL) current in 90nm CMOS technology using lightly-doped drain (LDD) NMOSFET. This paper shows that the drain bias VD has a strong effect on GIDL current as compared with the gate bias VG at the same drain–gate voltage VDG.
Chen Hai-Feng +7 more
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Effects of X-ray irradiation on GIDL in MOSFETs
IEEE Electron Device Letters, 1992The effect of X-ray irradiation on the gate-induced drain leakage (GIDL) is shown to be mostly due to the electrostatic effect of the trapped positive charge in n-channel MOSFETs. In p-channel MOSFETs, in addition, irradiation increases the interface-state-assisted tunneling component of the GIDL.
A. Acovic +4 more
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PMOSFET anti-fuse using GIDL-induced-HEIP mechanism
Microelectronics Reliability, 2010Abstract We propose a novel electrical fuse (e-fuse) program procedure using shallow trench isolation (STI) edge trapping mechanism of PMOSFET by applying AC pulses. We obtained flash characteristics using conventional PMOSFET structure, when injected AC pulse on source node under off-state condition (Vg = high, Vd = low).
J. Y. Seo +5 more
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Approximations to field-effect factor and their use in GIDL modeling
18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2011New analytical approximations to field-effect factor used in gate induced drain leakage (GIDL) current modeling are presented. Modeling results for GIDL currents in sphere-shaped recessed channel array transistor (SRCAT) and NMOSFET obtained with the use of new approximations were compared to the measurement data in order to prove the validity of the ...
Nikita Kozhukhov +2 more
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A New Tunnelling Model To Calculate GIDL Current For MOSFET And TFET
2019 International Semiconductor Conference (CAS), 2019This paper has proposed an innovative band to band tunneling current model using De- Casteljau’s algorithm, followed by Bezier curve method and WKB approximation. After verifying the validity of this proposed tunneling model with respect to electron energy and tunnel width, the expression of tunneling probability is applied to the graded drain MOSFET ...
A. Sen, J. Das
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Anomalous Capacitance Induced by GIDL in P-Channel LTPS TFTs
IEEE Electron Device Letters, 2009In this letter, a mechanism of anomalous capacitance in p-channel low-temperature polycrystalline silicon thin-film transistors (LTPS TFTs) was investigated. In general, the effective capacitance was only the overlap region and independent with the frequency in LTPS TFTs under the off state. However, our experimental results reveal that the capacitance
null Chia-Sheng Lin +9 more
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GIDL in Doped and Undoped FinFET Devices for Low-Leakage Applications
IEEE Electron Device Letters, 2013Investigation of gate-induced drain leakage (GIDL) in thick-oxide dual-gate doped- and undoped-channel FinFET devices through 3-D process and device simulations is presented. For a given gate length (LG) and gate dielectric thickness, the placement and grading of the drain junction and the channel doping are shown to have a tremendous impact on GIDL ...
Pranita Kerber +3 more
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Impact of substrate bias on GIDL for thin-BOX ETSOI devices
2011 International Conference on Simulation of Semiconductor Processes and Devices, 2011We present a detailed analysis of substrate bias (V bb ) impact on gate induced drain leakage (GIDL) for thin-BOX extremely thin silicon-on-insulator (ETSOI) with BOX thickness (T BOX ) ranging from 10 to 50 nm and inversion layer thicknesses (T INV ) ranging from 1.1 to 1.3 nm.
P. Kulkarni +6 more
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