For the first time, we use electrical characterization, spectrally-resolved electroluminescence measurements and degradation tests to explain the negative activation energy of gate reliability in power GaN HEMTs with p-GaN Schottky gate.
Manuel Fregolent +14 more
doaj +1 more source
This study introduces an enhanced high electron mobility transistor with a lattice-matched AlInGaN/GaN heterojunction and a composite gate structure (CGS). The CGS comprises a recessed gate and a P-type cap layer gate.
Kai Niu +9 more
doaj +1 more source
Influence of p-GaN gate airgap in p-GaN AlGaN/GaN HEMTs for improved DC performance
Abstract This study proposes a novel p-GaN AlGaN/GaN high-electron-mobility transistor (HEMT) structure incorporating a gate airgap to address gate leakage and high electric field issues. Comprehensive device simulations conducted using COMSOL Multiphysics show that the airgap-integrated design enhances the breakdown voltage by 47.7% and ...
Muhaimin Haziq +3 more
openaire +1 more source
Device Simulation of P-InAlN-Gate AlGaN/GaN High Electron Mobility Transistor
We simulate a p-InAlN gate AlGaN/GaN high electron mobility transistor (HEM). The studied HEMT is operated at an enhancement mode (e-mode) with positive threshold voltage and low gate leakage current at high gate voltage.
Han-Tung Chang +4 more
core
MOCVD-Grown AlGaN/AlN/GaN HEMT Structure with High Mobility GaN Thin Layer as Channel on SiC
AlGaN/AlN/GaN high electron mobility transistor (HEMT) structures with a high-mobility GaN thin layer as a channel are grown on high resistive 6H-SiC substrates by metalorganic chemical vapor deposition.
Li Jianping +11 more
core
Achieving low ON-resistance in E-mode regrown U-shaped p-GaN gate multi-channel HEMT
This work demonstrates an E-mode regrown U-shaped p-GaN gate multi-channel HEMT on a sapphire substrate. The multi-channel access region is favorable to reducing the ON-resistance (RON).
Jiawei Cui +11 more
core +1 more source
Damage Mechanism of GaN HEMT and Failure Analysis of Power Amplifier Under High-Altitude Electromagnetic Pulse. [PDF]
Sun L, Wu H, Tian J, Bai K.
europepmc +1 more source
High-Efficiency Sub-100 nm Gate GaN HEMTs Enabled by Two-Step SiN<sub>x</sub> Layer Etching Technique. [PDF]
Cao X +13 more
europepmc +1 more source
Monolithically integrating polarization-doped InGaN p-FET and GaN n-FET for complementary logic circuitry. [PDF]
Yu J +12 more
europepmc +1 more source
Atomically confined insertion for 2D strain and polarization engineered GaN electronics. [PDF]
Shi Y +13 more
europepmc +1 more source

