Results 41 to 50 of about 96,299 (290)

Plasma power effect on crystallinity and density of AlN films deposited by plasma enhanced atomic layer deposition

open access: yesJournal of Materials Research and Technology, 2023
Aluminum nitride (AlN) film is a promising material which is used in various fields. In this study, AlN films with different plasma powers were grown by remote plasma atomic layer deposition.
Xiao-Ying Zhang   +12 more
doaj   +1 more source

Plasma Enhanced Atomic Layer Deposition of Iridium Oxide for Application in Miniaturized Neural Implants

open access: yesCurrent Directions in Biomedical Engineering, 2021
High quality recording of neuronal activities and electrical stimulation require neurotechnical implants with appropriate electrode material. Iridium oxide (IrOx) is an excellent choice of material due to its biocompatibility, low electrochemical ...
Simon Nicolai   +3 more
doaj   +1 more source

Structural, Surface, and Optical Properties of AlN Thin Films Grown on Different Substrates by PEALD

open access: yesCrystals, 2023
Plasma-enhanced atomic layer deposition was employed to grow aluminum nitride (AlN) thin films on Si (100), Si (111), and c-plane sapphire substrates at 250 °C. Trimethylaluminum and Ar/N2/H2 plasma were utilized as Al and N precursors, respectively. The
Sanjie Liu   +4 more
doaj   +1 more source

Plasma-enhanced atomic layer deposition of titanium vanadium nitride [PDF]

open access: yesJournal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 2018
The authors have studied the plasma-enhanced atomic layer deposition of TixV1−xN using tetrakis(dimethylamido) titanium, tetrakis(dimethylamido) vanadium, and nitrogen plasma. Through modification of the ratio of TiN to VN deposition cycles, the value of x can be well controlled.
Mark J. Sowa   +7 more
openaire   +1 more source

Design of a Solid Freeform Fabrication Diamond Reactor [PDF]

open access: yes, 1990
Solid Freeform Fabrication (SFF) has progressed from the visualization aided stage of computer aided designs (CAD) to rapid prototyping of structural parts.
Marcus, Harris L.   +2 more
core   +1 more source

Optimization of $Al/AlO_x/Al$-Layer Systems for Josephson Junctions from a Microstructure Point of View [PDF]

open access: yes, 2019
$Al/AlO_x/Al$-layer systems are frequently used for Josephson junction-based superconducting devices. Although much work has been devoted to the optimization of the superconducting properties of these devices, systematic studies on influence of ...
Fritz, S.   +4 more
core   +2 more sources

Plasma-Enhanced Atomic Layer Deposition-Based Ferroelectric Field-Effect Transistors

open access: yesIEEE Journal of the Electron Devices Society
The use of the plasma-enhanced atomic layer deposition (ALD) technique for the deposition of HfO2-based ferroelectrics has received attention in recent years primarily due to wake-up free operation.
Chinsung Park   +13 more
doaj   +1 more source

Schottky Diodes on ZnO Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition [PDF]

open access: yes, 2017
Enhancement of the properties of zinc oxide (ZnO)-based Schottky diodes has been explored using a combination of plasma-enhanced atomic layer deposition (PE-ALD) ZnO thin films and silver oxide Schottky contacts deposited by reactive radio-frequency ...
Chalker, PR   +11 more
core   +1 more source

Plasma-Enhanced Atomic Layer Deposition (PEALD) of TiN using the Organic Precursor Tetrakis(ethylmethylamido)Titanium (TEMAT)

open access: yesMATEC Web of Conferences, 2016
This paper presents the plasma-enhanced atomic layer deposition (PEALD) of titanium nitride (TiN) using the organic precursor tetrakis(ethylmethylamido)titanium (TEMAT), with remote ammonia (NH3) plasma as reactant gas.
Chen Z.X., Li X., Li W.-M., Lo G.-Q.
doaj   +1 more source

Passivation of Edge States in Etched InAs Sidewalls

open access: yes, 2017
We investigate different methods of passivating sidewalls of wet etched InAs heterostructures in order to suppress inherent edge conduction that is presumed to occur due to band bending at the surface leading to charge carrier accumulation.
Ensslin, Klaus   +8 more
core   +1 more source

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