Results 51 to 60 of about 4,054 (213)

Design Optimization of a Variable Stiffness Robotic Gripper with Passive Restoration Fabricated by Multimaterial 3D Printing

open access: yesAdvanced Robotics Research, EarlyView.
A multimaterial robotic gripper fabricated via multimaterial 3D printing integrates conductive thermopolymer joints with flexible elastomeric components. Joule heating enables precise joint‐level stiffness modulation, enhanced by embedded temperature sensors, passive shape restoration, and active cooling, enabling versatile manipulation capabilities ...
Daniel Jee Seng Goh   +4 more
wiley   +1 more source

Modular, Textile‐Based Soft Robotic Grippers for Agricultural Produce Handling

open access: yesAdvanced Robotics Research, EarlyView.
This article introduces textile‐based pneumatic grippers that transform simple textiles into robust bending actuators. Detailed experiments uncover how cut geometry and fabric selection shape performance. Successful handling of fragile agricultural items showcases the potential of textile robotics for safe, scalable automation in food processing and ...
Zeyu Hou   +4 more
wiley   +1 more source

An Optimized Vertical GaN Parallel Split Gate Trench MOSFET Device Structure for Improved Switching Performance

open access: yesIEEE Access, 2023
This work proposes a vertical gallium nitride (GaN) parallel split gate trench MOSFET (PSGT-MOSFET) device architecture suitable for power conversion applications.
Nilesh Kumar Jaiswal, V. N. Ramakrishnan
doaj   +1 more source

Smart Energy–Harvesting Coating for Moisture–Droplets Based on Ionic Diodes and Transistor–Like Structures

open access: yesAdvanced Science, EarlyView.
A smart power‐generating coating is developed to harvest energy from both ambient humidity and impacting liquid droplets. The integrated system delivers sustained open‐circuit voltages of 0.85 V from moisture and up to 36 V from droplets. Its scalable coating architecture enables a continuous power supply for low‐power electronic devices.
Liang Ma   +5 more
wiley   +1 more source

Research on High-power Full SiC Converter

open access: yes机车电传动, 2018
In order to adapt to the development trend of high frequency and high power density of converter products, the application of high-power all-SiC-MOSFET device in converter was studied.
ZHANG Qing   +5 more
doaj  

In Situ Quantization with Memory‐Transistor Transfer Unit Based on Electrochemical Random‐Access Memory for Edge Applications

open access: yesAdvanced Science, EarlyView.
By combining ionic nonvolatile memories and transistors, this work proposes a compact synaptic unit to enable low‐precision neural network training. The design supports in situ weight quantization without extra programming and achieves accuracy comparable to ideal methods. This work obtains energy consumption advantage of 25.51× (ECRAM) and 4.84× (RRAM)
Zhen Yang   +9 more
wiley   +1 more source

A Novel 4H‐SiC MOSFET With High‐K/Low‐K Dielectric for Improved Frequency Characteristics

open access: yesIET Power Electronics
Split‐Gate MOSFET (SG‐MOSFET) is promising in power‐switching circuits due to the fast turn‐on/off speed and low switching loss. However, in higher‐frequency applications, the gate architecture needs to be changed to obtain the improved high‐frequency ...
Jiaxing Chen, Juntao Li, Lin Zhang
doaj   +1 more source

Pellet Printing for Soft Robotic Devices

open access: yesAdvanced Science, EarlyView.
Fused Granulate Fabrication (FGF) is established here as a reliable method for fabricating soft, airtight robotic devices. Through coordinated optimization of hardware, material selection, and process parameters, this approach enables high‐speed printing of thermoplastic elastomers with silicone‐like softness and modulus.
Yijia Wu   +6 more
wiley   +1 more source

Breakdown Characteristics of Ga2O3-on-SiC Metal-Oxide-Semiconductor Field-Effect Transistors

open access: yesCrystals, 2023
Ultra-wide bandgap semiconductor gallium oxide (Ga2O3) features a breakdown strength of 8 MV/cm and bulk mobility of up to 300 cm2V−1s−1, which is considered a promising candidate for next-generation power devices.
Maolin Zhang   +5 more
doaj   +1 more source

Fabrication of High‐Density Multimodal Neural Probes Based on Heterogeneously Integrated CMOS

open access: yesAdvanced Science, EarlyView.
A chiplet‐based methodology democratizes active neural probe development on standard bulk CMOS services. This yields the first probe combining high‐density electrophysiology (416 electrodes) with calcium imaging (832 photodiodes) and complete on‐chip signal processing across 13 shanks.
Ju Hee Mun   +10 more
wiley   +1 more source

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