1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit [PDF]
1.1 General description Logic level enhancement mode N-channel MOSFET in LFPAK package. This product is designed and qualified for use in a wide range of industrial, communications and domestic equipment.
Nextpower Technology
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Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VDS drain-source voltage 25 °C ≤ Tj ≤ 175 °C-- 30 V [PDF]
Logic level enhancement mode N-channel MOSFET in LFPAK package. This product is designed and qualified for use in a wide range of industrial, communications and domestic equipment. 1.2 Features and benefits High reliability Power SO8 package, qualified
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New Power MOSFET with Beyond-1D-Limit RSP-BV Trade-Off and Superior Reverse Recovery Characteristics. [PDF]
Zhang M, Li B, Wei J.
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Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit [PDF]
Logic level enhancement mode N-channel MOSFET in LFPAK33 package. This product is designed and qualified for use in a wide range of industrial, communications and domestic equipment.
Using Nextpower Technology +2 more
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150-200 V Split-Gate Trench Power MOSFETs with Multiple Epitaxial Layers. [PDF]
Chien FT +5 more
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Analysis of Superjunction MOSFET (CoolMOS™) Concept Limitations-Part I: Theory. [PDF]
Lisik Z, Podgórski J.
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Editor's Choice Articles in the Electronic Materials Section of <i>Materials</i> in 2025. [PDF]
Roccaforte F.
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Electro-Thermal Improvement in a β-Ga<sub>2</sub>O<sub>3</sub> Cage-Integrated Slanted-Fin MOSFET. [PDF]
Li J, Li Y, Peng K, Lu X, Ma X.
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Simulation Study on 6.5 kV SiC Trench Gate p-Channel Superjunction Insulated Gate Bipolar Transistor. [PDF]
Kang KM, Hu JW, Huang CF.
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Silicon-on-Insulator (SOI) Lateral Power-Reduced Surface Field FinFET with High-Power Figure of Merit of 239.3 MW/cm<sup>2</sup>. [PDF]
Song CW, Lee T, Kim D, Kyoung S, Woo S.
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