Results 21 to 30 of about 733 (170)

The Avalanche-Mode Superjunction LED [PDF]

open access: yesIEEE Transactions on Electron Devices, 2017
Avalanche-mode light-emitting diodes (AMLEDs) in silicon (Si) are potential light sources to enable monolithic optical links in standard CMOS technology, due to the large overlap of their electroluminescent (EL) spectra with the responsivity of Si photodiodes. These EL spectra depend on the reverse electric field.
Satadal Dutta   +5 more
openaire   +4 more sources

A Review on Recent Advances in Matrix Converter Technology: Topologies, Control, Applications, and Future Prospects

open access: yesInternational Journal of Energy Research, Volume 2023, Issue 1, 2023., 2023
Matrix converters (MCs) are AC‐AC power conversion topologies widely explored and applied in the industry for their attractive features of sinusoidal input and output currents, considerable size reduction, and reliable operation due to the omission of bulky passive components.
Mohammad Ali   +3 more
wiley   +1 more source

Review of Technologies for High-Voltage Integrated Circuits

open access: yesTsinghua Science and Technology, 2022
High-Voltage power Integrated Circuits (HVICs) are widely used to realize high-efficiency power conversions (e.g., AC/DC conversion), gate drivers for power devices and LED lighting, and so on. The Bipolar-CMOS-DMOS (BCD) process is proposed to fabricate
Bo Zhang   +5 more
doaj   +1 more source

A Fast Recovery Vertical Superjunction MOSFET with n-Si and p-3C-SiC Pillars

open access: yesCrystals, 2022
In the traditional SJ MOSFET structure, n/p pillars with the same doping concentrations in the drift region are introduced to decrease the on-resistance.
Rongyu Gao   +6 more
doaj   +1 more source

A new trench gate field stop insulated gate bipolar transistor (IGBT) with a significant reduction in Miller capacitance

open access: yesMicro &Nano Letters, Volume 16, Issue 2, Page 121-126, February 2021., 2021
Abstract In this paper, a new trench‐gate field‐stop insulated gate bipolar transistor (IGBT) structure having improved performances is proposed, investigated and compared with the properties of the conventional trench‐gate field‐stop IGBT. An npn structure is introduced to the gate trench in order to reduce the Miller capacitance and gate‐collector ...
Yan‐juan Liu   +3 more
wiley   +1 more source

Superjunction Power Transistors With Interface Charges: A Case Study for GaN

open access: yesIEEE Journal of the Electron Devices Society, 2020
Recent progress in p-GaN trench-filling epitaxy has shown promise for the demonstration of GaN superjunction (SJ) devices. However, the presence of n-type interface charges at the regrowth interfaces has been widely observed. These interface charges pose
Yunwei Ma   +4 more
doaj   +1 more source

Analysis of Superjunction MOSFET (CoolMOS™) Concept Limitations-Part I: Theory. [PDF]

open access: yesMaterials (Basel)
The CoolMOS™ (Infineon Technologies AG, Munich, Germany) has been considered a device that alleviates high-voltage limitations of unipolar power devices, but although the theoretical considerations seem to confirm such a possibility, this ...
Lisik Z, Podgórski J.
europepmc   +2 more sources

Lateral GaN Schottky superjunction diodes with buried p-GaN by NH3-MBE [PDF]

open access: yesAPL Electronic Devices
In this work, we demonstrate lateral GaN Schottky superjunction diodes using a p–n–p layer structure. The lateral nature of these devices circumvents the difficulties in achieving charge balance with etch and regrowth techniques. The p–n–p layer Schottky
Z. J. Biegler   +4 more
doaj   +1 more source

Low-voltage superjunction technology

open access: yesIET Circuits, Devices & Systems, 2007
: The scalability of superjunction and superfield power MOSFET technologies to break-down voltage lower than 250 V is investigated. The influence of device geometry and process architecture on the switching figures-of-merit of these relatively new classes of power switches with a breakdown voltage rating of 80 V is presented. The current flow and field
Deva N. Pattanayak   +2 more
openaire   +2 more sources

Modeling of Al Doping During 4H-SiC Chemical-Vapor-Deposition Trench Filling

open access: yesIEEE Journal of the Electron Devices Society, 2019
Aluminum doping during 4H-SiC chemical-vapor-deposition (CVD) trench filling was numerically modeled toward precise design of high-voltage superjunction devices.
Kazuhiro Mochizuki   +3 more
doaj   +1 more source

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